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CHIPcon 2025.

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Bibliographic Details
Title: CHIPcon 2025.
Source: Advancing Microelectronics. 2025, Vol. 52 Issue 3, p26-36. 11p.
Subjects: Wafer level packaging, Career development, Generative artificial intelligence, Thermal interface materials, Language models, Flip chip technology, Systems on a chip, Edge computing
Database: Engineering Source
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DbLabel: Engineering Source
An: 186116118
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PubType: Periodical
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  Data: CHIPcon 2025.
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  Data: <searchLink fieldCode="JN" term="%22Advancing+Microelectronics%22">Advancing Microelectronics</searchLink>. 2025, Vol. 52 Issue 3, p26-36. 11p.
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  Data: <searchLink fieldCode="DE" term="%22Wafer+level+packaging%22">Wafer level packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Career+development%22">Career development</searchLink><br /><searchLink fieldCode="DE" term="%22Generative+artificial+intelligence%22">Generative artificial intelligence</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+interface+materials%22">Thermal interface materials</searchLink><br /><searchLink fieldCode="DE" term="%22Language+models%22">Language models</searchLink><br /><searchLink fieldCode="DE" term="%22Flip+chip+technology%22">Flip chip technology</searchLink><br /><searchLink fieldCode="DE" term="%22Systems+on+a+chip%22">Systems on a chip</searchLink><br /><searchLink fieldCode="DE" term="%22Edge+computing%22">Edge computing</searchLink>
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RecordInfo BibRecord:
  BibEntity:
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 11
        StartPage: 26
    Subjects:
      – SubjectFull: Wafer level packaging
        Type: general
      – SubjectFull: Career development
        Type: general
      – SubjectFull: Generative artificial intelligence
        Type: general
      – SubjectFull: Thermal interface materials
        Type: general
      – SubjectFull: Language models
        Type: general
      – SubjectFull: Flip chip technology
        Type: general
      – SubjectFull: Systems on a chip
        Type: general
      – SubjectFull: Edge computing
        Type: general
    Titles:
      – TitleFull: CHIPcon 2025.
        Type: main
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              M: 05
              Text: 2025
              Type: published
              Y: 2025
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              Value: 52
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            – TitleFull: Advancing Microelectronics
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