Transparent Electrodes Based on Crack-Templated Metallic Networks for Next-Generation Optoelectronics.
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| Title: | Transparent Electrodes Based on Crack-Templated Metallic Networks for Next-Generation Optoelectronics. |
|---|---|
| Authors: | Cama, Eleonora Sofia1 (AUTHOR), Pasini, Mariacecilia1 (AUTHOR), Galeotti, Francesco1 (AUTHOR), Giovanella, Umberto1 (AUTHOR) umberto.giovanella@cnr.it |
| Source: | Materials (1996-1944). Jul2025, Vol. 18 Issue 13, p3091. 33p. |
| Subjects: | Optoelectronics, Transparent electronics, Metal mesh, Technological innovations, Electric conductivity, Light transmission, Crack formation in solids, Flexibility (Mechanics) |
| Abstract: | Transparent conductive electrodes (TCEs) are essential components in modern optoelectronic devices, including organic light-emitting diodes and solar cells, sensors, and flexible displays. Indium tin oxide has been the dominant material for TCEs due to its high transparency and conductivity. However, its brittleness, high cost, and increasingly limited availability pose significant challenges for electronics. Crack-template (CT)-assisted fabrication has emerged as a promising technique to develop metal mesh-based TCEs with superior mechanical flexibility, high conductivity, and excellent optical transmittance. This technique leverages the spontaneous formation of random and continuous microcrack networks in sacrificial templates, followed by metal deposition (e.g., Cu, Ag, Al, etc.), to produce highly conductive, scalable, and low-cost electrodes. Various crack formation strategies, including controlled drying of polymer suspensions, mechanical strain engineering, and thermal processing, have been explored to tailor electrode properties. Recent studies have demonstrated that crack-templated TCEs can achieve transmittance values exceeding 85% and sheet resistances below 10 Ω/sq, with mesh line widths as low as ~40 nm. Moreover, these electrodes exhibit enhanced stretchability and robustness under mechanical deformation, outperforming ITO in bend and fatigue tests. This review aims to explore recent advancements in CT engineering, highlighting key fabrication methods, performance metrics across different metals and substrates, and presenting examples of its applications in optoelectronic devices. Additionally, it will examine current challenges and future prospects for the widespread adoption of this emerging technology. [ABSTRACT FROM AUTHOR] |
| Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
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| Header | DbId: egs DbLabel: Engineering Source An: 186596854 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Transparent Electrodes Based on Crack-Templated Metallic Networks for Next-Generation Optoelectronics. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Cama%2C+Eleonora+Sofia%22">Cama, Eleonora Sofia</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Pasini%2C+Mariacecilia%22">Pasini, Mariacecilia</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Galeotti%2C+Francesco%22">Galeotti, Francesco</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Giovanella%2C+Umberto%22">Giovanella, Umberto</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> umberto.giovanella@cnr.it</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Materials+%281996-1944%29%22">Materials (1996-1944)</searchLink>. Jul2025, Vol. 18 Issue 13, p3091. 33p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Optoelectronics%22">Optoelectronics</searchLink><br /><searchLink fieldCode="DE" term="%22Transparent+electronics%22">Transparent electronics</searchLink><br /><searchLink fieldCode="DE" term="%22Metal+mesh%22">Metal mesh</searchLink><br /><searchLink fieldCode="DE" term="%22Technological+innovations%22">Technological innovations</searchLink><br /><searchLink fieldCode="DE" term="%22Electric+conductivity%22">Electric conductivity</searchLink><br /><searchLink fieldCode="DE" term="%22Light+transmission%22">Light transmission</searchLink><br /><searchLink fieldCode="DE" term="%22Crack+formation+in+solids%22">Crack formation in solids</searchLink><br /><searchLink fieldCode="DE" term="%22Flexibility+%28Mechanics%29%22">Flexibility (Mechanics)</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Transparent conductive electrodes (TCEs) are essential components in modern optoelectronic devices, including organic light-emitting diodes and solar cells, sensors, and flexible displays. Indium tin oxide has been the dominant material for TCEs due to its high transparency and conductivity. However, its brittleness, high cost, and increasingly limited availability pose significant challenges for electronics. Crack-template (CT)-assisted fabrication has emerged as a promising technique to develop metal mesh-based TCEs with superior mechanical flexibility, high conductivity, and excellent optical transmittance. This technique leverages the spontaneous formation of random and continuous microcrack networks in sacrificial templates, followed by metal deposition (e.g., Cu, Ag, Al, etc.), to produce highly conductive, scalable, and low-cost electrodes. Various crack formation strategies, including controlled drying of polymer suspensions, mechanical strain engineering, and thermal processing, have been explored to tailor electrode properties. Recent studies have demonstrated that crack-templated TCEs can achieve transmittance values exceeding 85% and sheet resistances below 10 Ω/sq, with mesh line widths as low as ~40 nm. Moreover, these electrodes exhibit enhanced stretchability and robustness under mechanical deformation, outperforming ITO in bend and fatigue tests. This review aims to explore recent advancements in CT engineering, highlighting key fabrication methods, performance metrics across different metals and substrates, and presenting examples of its applications in optoelectronic devices. Additionally, it will examine current challenges and future prospects for the widespread adoption of this emerging technology. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.3390/ma18133091 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 33 StartPage: 3091 Subjects: – SubjectFull: Optoelectronics Type: general – SubjectFull: Transparent electronics Type: general – SubjectFull: Metal mesh Type: general – SubjectFull: Technological innovations Type: general – SubjectFull: Electric conductivity Type: general – SubjectFull: Light transmission Type: general – SubjectFull: Crack formation in solids Type: general – SubjectFull: Flexibility (Mechanics) Type: general Titles: – TitleFull: Transparent Electrodes Based on Crack-Templated Metallic Networks for Next-Generation Optoelectronics. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Cama, Eleonora Sofia – PersonEntity: Name: NameFull: Pasini, Mariacecilia – PersonEntity: Name: NameFull: Galeotti, Francesco – PersonEntity: Name: NameFull: Giovanella, Umberto IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 07 Text: Jul2025 Type: published Y: 2025 Identifiers: – Type: issn-print Value: 19961944 Numbering: – Type: volume Value: 18 – Type: issue Value: 13 Titles: – TitleFull: Materials (1996-1944) Type: main |
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