APA (7th ed.) Citation

Chen, X., Fu, X., Chen, Z., Zhai, Z., Miu, H., & Tao, P. (2025). Multifunctional Polyimide for Packaging and Thermal Management of Electronics: Design, Synthesis, Molecular Structure, and Composite Engineering. Nanomaterials (2079-4991), 15(15), 1148. https://doi.org/10.3390/nano15151148

Chicago Style (17th ed.) Citation

Chen, Xi, Xin Fu, Zhansheng Chen, Zaiteng Zhai, Hongkang Miu, and Peng Tao. "Multifunctional Polyimide for Packaging and Thermal Management of Electronics: Design, Synthesis, Molecular Structure, and Composite Engineering." Nanomaterials (2079-4991) 15, no. 15 (2025): 1148. https://doi.org/10.3390/nano15151148.

MLA (9th ed.) Citation

Chen, Xi, et al. "Multifunctional Polyimide for Packaging and Thermal Management of Electronics: Design, Synthesis, Molecular Structure, and Composite Engineering." Nanomaterials (2079-4991), vol. 15, no. 15, 2025, p. 1148, https://doi.org/10.3390/nano15151148.