APA (7th ed.) Citation

Ye, P., Han, J., Braye, S., ElSawy, A., Khanna, H., Hayes, V., . . . Richardson, T. (2025). Metastable Fine Grain Cu for Hybrid Bonding Applications. Advancing Microelectronics, 52(4), 30.

Chicago Style (17th ed.) Citation

Ye, Pingping, Jianwen Han, Stephan Braye, Abdelhamid ElSawy, Harshul Khanna, Veronica Hayes, Adam Letize, Kyle Whitten, and Thomas Richardson. "Metastable Fine Grain Cu for Hybrid Bonding Applications." Advancing Microelectronics 52, no. 4 (2025): 30.

MLA (9th ed.) Citation

Ye, Pingping, et al. "Metastable Fine Grain Cu for Hybrid Bonding Applications." Advancing Microelectronics, vol. 52, no. 4, 2025, p. 30.