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Metastable Fine Grain Cu for Hybrid Bonding Applications.

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Title: Metastable Fine Grain Cu for Hybrid Bonding Applications.
Authors: Ye, Pingping1 pingping.ye@macdermidalpha.com, Han, Jianwen1, Braye, Stephan1, ElSawy, Abdelhamid1, Khanna, Harshul1, Hayes, Veronica1, Letize, Adam1, Whitten, Kyle1, Richardson, Thomas1
Source: Advancing Microelectronics. 2025, Vol. 52 Issue 4, p30-33. 4p.
Subjects: Grain refinement, Thermal stability, Interfacial bonding, Nanostructured materials, Annealing of metals, Rapid thermal processing
Abstract: Utilizing metastable fine-grain copper offers an opportunity to implement low-thermal budget hybrid bonding techniques. We outline several methods for characterizing fine-grain structures and a screening process to refine these structures. Furthermore, we explore the differences in copper grain evolution between blanket and patterned wafers at room temperature. Finally, we introduce metastable fine-grain copper, which demonstrates stability for four weeks of self-annealing and maintains stability through annealing at 150°C for 2 hours, with grain growth occurring at 250°C. The capability to maintain fine-grain copper over an extended period presents a promising solution for low-thermal budget hybrid bonding. [ABSTRACT FROM AUTHOR]
Copyright of Advancing Microelectronics is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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Header DbId: egs
DbLabel: Engineering Source
An: 187387114
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PubType: Periodical
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  Data: Metastable Fine Grain Cu for Hybrid Bonding Applications.
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  Data: <searchLink fieldCode="AR" term="%22Ye%2C+Pingping%22">Ye, Pingping</searchLink><relatesTo>1</relatesTo><i> pingping.ye@macdermidalpha.com</i><br /><searchLink fieldCode="AR" term="%22Han%2C+Jianwen%22">Han, Jianwen</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Braye%2C+Stephan%22">Braye, Stephan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22ElSawy%2C+Abdelhamid%22">ElSawy, Abdelhamid</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Khanna%2C+Harshul%22">Khanna, Harshul</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Hayes%2C+Veronica%22">Hayes, Veronica</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Letize%2C+Adam%22">Letize, Adam</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Whitten%2C+Kyle%22">Whitten, Kyle</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Richardson%2C+Thomas%22">Richardson, Thomas</searchLink><relatesTo>1</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Advancing+Microelectronics%22">Advancing Microelectronics</searchLink>. 2025, Vol. 52 Issue 4, p30-33. 4p.
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  Data: <searchLink fieldCode="DE" term="%22Grain+refinement%22">Grain refinement</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+stability%22">Thermal stability</searchLink><br /><searchLink fieldCode="DE" term="%22Interfacial+bonding%22">Interfacial bonding</searchLink><br /><searchLink fieldCode="DE" term="%22Nanostructured+materials%22">Nanostructured materials</searchLink><br /><searchLink fieldCode="DE" term="%22Annealing+of+metals%22">Annealing of metals</searchLink><br /><searchLink fieldCode="DE" term="%22Rapid+thermal+processing%22">Rapid thermal processing</searchLink>
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  Label: Abstract
  Group: Ab
  Data: Utilizing metastable fine-grain copper offers an opportunity to implement low-thermal budget hybrid bonding techniques. We outline several methods for characterizing fine-grain structures and a screening process to refine these structures. Furthermore, we explore the differences in copper grain evolution between blanket and patterned wafers at room temperature. Finally, we introduce metastable fine-grain copper, which demonstrates stability for four weeks of self-annealing and maintains stability through annealing at 150°C for 2 hours, with grain growth occurring at 250°C. The capability to maintain fine-grain copper over an extended period presents a promising solution for low-thermal budget hybrid bonding. [ABSTRACT FROM AUTHOR]
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  Data: <i>Copyright of Advancing Microelectronics is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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      – SubjectFull: Thermal stability
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      – SubjectFull: Annealing of metals
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      – SubjectFull: Rapid thermal processing
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              M: 07
              Text: 2025
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