APA (7th ed.) Citation

Huang, J., Tran, D., Lee, K., Lin, Y., Kuo, E., Chen, T., . . . Chen, C. (2025). Enhancement of Cu-Cu Bonding Interfaces Through High Creep Rate in Nanocrystalline Cu. Materials (1996-1944), 18(16), 3725. https://doi.org/10.3390/ma18163725

Chicago Style (17th ed.) Citation

Huang, Jian-Yuan, Dinh-Phuc Tran, Kang-Ping Lee, Yi-Quan Lin, Emile Kuo, Tsung-Chuan Chen, Yao-Tsung Chen, Stream Chung, and Chih Chen. "Enhancement of Cu-Cu Bonding Interfaces Through High Creep Rate in Nanocrystalline Cu." Materials (1996-1944) 18, no. 16 (2025): 3725. https://doi.org/10.3390/ma18163725.

MLA (9th ed.) Citation

Huang, Jian-Yuan, et al. "Enhancement of Cu-Cu Bonding Interfaces Through High Creep Rate in Nanocrystalline Cu." Materials (1996-1944), vol. 18, no. 16, 2025, p. 3725, https://doi.org/10.3390/ma18163725.