Enhancement of Cu-Cu Bonding Interfaces Through High Creep Rate in Nanocrystalline Cu. - Huang, Jian-Yuan; Tran, Dinh-Phuc; Lee, Kang-Ping; Lin, Yi-Quan; Kuo, Emile; Chen, Tsung-Chuan; Chen, Yao-Tsung; Chung, Stream; Chen, Chih (Materials (1996-1944), 2025)