Design, flow characteristics and thermal performance analysis of TPMS-based heat exchangers with SC2-FCC arrangement.

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Bibliographic Details
Title: Design, flow characteristics and thermal performance analysis of TPMS-based heat exchangers with SC2-FCC arrangement.
Authors: Yang, Guan-Hua1 (AUTHOR), Li, Jing-Rong1 (AUTHOR), Chi, Zi-Peng1 (AUTHOR), Wang, Qing-Hui1 (AUTHOR) wqh@scut.edu.cn
Source: International Communications in Heat & Mass Transfer. Nov2025, Vol. 168, pN.PAG-N.PAG. 1p.
Subjects: Heat exchangers, Surface area, Thermal conductivity, Fluid dynamics, Face centered cubic structure, Minimal surfaces, Porosity, Computer simulation
Abstract: Efficient thermal management is crucial for electronic devices and industrial manufacturing. Currently, triply periodic minimal surface (TPMS) structures are widely used as compact heat exchangers due to their high specific surface area. This work finds that, compared to TPMS units, structures with Simple-Cubic and Face-Centered Cubic (SC2-FCC) arrangement have a significantly larger specific surface area, with the potential to further improve thermal performance. Therefore, the flow characteristics and heat transfer mechanisms of SC2-FCC arranged TPMS-based structures are investigated. First, a design method and a blending algorithm are proposed, which could generate multi-morphology TPMS-based structures with SC2-FCC arrangement. Then, heat exchangers based on the novel structures and TPMS units are designed. Finally, numerical simulations are conducted at a Reynolds number of 100–500 and 1000. The results indicate that the comprehensive heat transfer performances of SC2-FCC arranged structures improve by over 39 % compared to basic TPMS structures at the same Reynolds number. Furthermore, a graded porosity design enhances heat transfer efficiency of the proposed SC2-FCC structure, but at the cost of increased pressure drop. This work demonstrates that the SC2-FCC arranged TPMS-based structure exhibits significant potential for application in advanced heat exchangers due to its flexible design freedom and outstanding thermal properties. [ABSTRACT FROM AUTHOR]
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Database: Engineering Source
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