Crack Severity Analysis in Predicting Solder Joint Reliability for Mirrored Flip Chip Ball Grid Array Packages.
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| Title: | Crack Severity Analysis in Predicting Solder Joint Reliability for Mirrored Flip Chip Ball Grid Array Packages. |
|---|---|
| Authors: | Ilias, Muhammad Nizam1,2 (AUTHOR), Bakar, Maria Abu1 (AUTHOR) maria@ukm.edu.my, Jalar, Azman1,3 (AUTHOR), Ismail, Adlil Aizat1,2 (AUTHOR), Basiron, Erwan1,2 (AUTHOR), Low, Sai Song2 (AUTHOR) |
| Source: | Journal of Failure Analysis & Prevention. Aug2025, Vol. 25 Issue 4, p1946-1959. 14p. |
| Subjects: | Solder joints, Ball grid array technology, Thickness measurement, Electronic equipment, Reliability in engineering, Thermocycling, Failure analysis, Fracture strength |
| Abstract: | Solder joint serves as metallurgical interconnection that ensuring both mechanical integrity and electrical functionality of electronic components. Solder joint reliability is essential to maintain the performance and lifespan of electronic components. Among various failure modes, crack formation within solder joints is a primary indicator of failure. However, detecting and analyzing cracks poses significant challenges, especially for components with many solder joints, such as in ball grid array (BGA) packages. This study aims to evaluate the effectiveness of a crack severity approach in predicting solder joint reliability for mirrored flip chip BGA (FCBGA) package mounted on different printed circuit boards (PCBs) thicknesses of 1.2 mm, 1.6 mm, and 2.0 mm. The FCBGA package was subjected to thermal cycling testing (TCT) ranging from 400 cycles up to 1200 cycles. Post-testing, the packages underwent dye and pull tests to map crack locations and quantify dye penetration percentages, providing a measure of crack severity. The results revealed that the thinnest PCB (1.2 mm) exhibited the highest cumulative crack severity at 6.52%, followed by the 1.6 mm PCB at 3.93%, and the thickest PCB (2.0 mm) showing the lowest crack severity of 2.17%. This indicates that thicker PCBs enhance solder joint reliability by reducing crack formation. Across all PCB thicknesses and TCT, bottom-side components consistently showed higher crack severity than topside components. Additionally, solder joints in the outermost rows (A and H) had the most severe cracks, while the inner rows (B to G) showed lower crack severity. In summary, this study provides valuable insights into the use of crack severity analysis as a practical and effective method for assessing solder joint reliability in mirrored FCBGA packages. It highlights the significant impact of PCB thickness, component placement, and solder ball position on crack development, offering guidance for improving electronic packaging reliability in industry applications. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Failure Analysis & Prevention is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 187971261 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Crack Severity Analysis in Predicting Solder Joint Reliability for Mirrored Flip Chip Ball Grid Array Packages. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Ilias%2C+Muhammad+Nizam%22">Ilias, Muhammad Nizam</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Bakar%2C+Maria+Abu%22">Bakar, Maria Abu</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> maria@ukm.edu.my</i><br /><searchLink fieldCode="AR" term="%22Jalar%2C+Azman%22">Jalar, Azman</searchLink><relatesTo>1,3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Ismail%2C+Adlil+Aizat%22">Ismail, Adlil Aizat</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Basiron%2C+Erwan%22">Basiron, Erwan</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Low%2C+Sai+Song%22">Low, Sai Song</searchLink><relatesTo>2</relatesTo> (AUTHOR) – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Failure+Analysis+%26+Prevention%22">Journal of Failure Analysis & Prevention</searchLink>. Aug2025, Vol. 25 Issue 4, p1946-1959. 14p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Solder+joints%22">Solder joints</searchLink><br /><searchLink fieldCode="DE" term="%22Ball+grid+array+technology%22">Ball grid array technology</searchLink><br /><searchLink fieldCode="DE" term="%22Thickness+measurement%22">Thickness measurement</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+equipment%22">Electronic equipment</searchLink><br /><searchLink fieldCode="DE" term="%22Reliability+in+engineering%22">Reliability in engineering</searchLink><br /><searchLink fieldCode="DE" term="%22Thermocycling%22">Thermocycling</searchLink><br /><searchLink fieldCode="DE" term="%22Failure+analysis%22">Failure analysis</searchLink><br /><searchLink fieldCode="DE" term="%22Fracture+strength%22">Fracture strength</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Solder joint serves as metallurgical interconnection that ensuring both mechanical integrity and electrical functionality of electronic components. Solder joint reliability is essential to maintain the performance and lifespan of electronic components. Among various failure modes, crack formation within solder joints is a primary indicator of failure. However, detecting and analyzing cracks poses significant challenges, especially for components with many solder joints, such as in ball grid array (BGA) packages. This study aims to evaluate the effectiveness of a crack severity approach in predicting solder joint reliability for mirrored flip chip BGA (FCBGA) package mounted on different printed circuit boards (PCBs) thicknesses of 1.2 mm, 1.6 mm, and 2.0 mm. The FCBGA package was subjected to thermal cycling testing (TCT) ranging from 400 cycles up to 1200 cycles. Post-testing, the packages underwent dye and pull tests to map crack locations and quantify dye penetration percentages, providing a measure of crack severity. The results revealed that the thinnest PCB (1.2 mm) exhibited the highest cumulative crack severity at 6.52%, followed by the 1.6 mm PCB at 3.93%, and the thickest PCB (2.0 mm) showing the lowest crack severity of 2.17%. This indicates that thicker PCBs enhance solder joint reliability by reducing crack formation. Across all PCB thicknesses and TCT, bottom-side components consistently showed higher crack severity than topside components. Additionally, solder joints in the outermost rows (A and H) had the most severe cracks, while the inner rows (B to G) showed lower crack severity. In summary, this study provides valuable insights into the use of crack severity analysis as a practical and effective method for assessing solder joint reliability in mirrored FCBGA packages. It highlights the significant impact of PCB thickness, component placement, and solder ball position on crack development, offering guidance for improving electronic packaging reliability in industry applications. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Failure Analysis & Prevention is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s11668-025-02256-x Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 14 StartPage: 1946 Subjects: – SubjectFull: Solder joints Type: general – SubjectFull: Ball grid array technology Type: general – SubjectFull: Thickness measurement Type: general – SubjectFull: Electronic equipment Type: general – SubjectFull: Reliability in engineering Type: general – SubjectFull: Thermocycling Type: general – SubjectFull: Failure analysis Type: general – SubjectFull: Fracture strength Type: general Titles: – TitleFull: Crack Severity Analysis in Predicting Solder Joint Reliability for Mirrored Flip Chip Ball Grid Array Packages. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Ilias, Muhammad Nizam – PersonEntity: Name: NameFull: Bakar, Maria Abu – PersonEntity: Name: NameFull: Jalar, Azman – PersonEntity: Name: NameFull: Ismail, Adlil Aizat – PersonEntity: Name: NameFull: Basiron, Erwan – PersonEntity: Name: NameFull: Low, Sai Song IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 08 Text: Aug2025 Type: published Y: 2025 Identifiers: – Type: issn-print Value: 15477029 Numbering: – Type: volume Value: 25 – Type: issue Value: 4 Titles: – TitleFull: Journal of Failure Analysis & Prevention Type: main |
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