APA (7th ed.) Citation

Schaffar, G. J., Burtscher, M., Taylor, A. A., Schrittwieser, D., Tscharnuter, D., Kiener, D., . . . Maier–Kiener, V. (2025). From nano-twinning to the glide of full dislocations: Micropillar compression tests on silicon up to 900 °C. Materials & Design, 258, N.PAG. https://doi.org/10.1016/j.matdes.2025.114730

Chicago Style (17th ed.) Citation

Schaffar, Gerald J.K., Michael Burtscher, Aidan A. Taylor, Daniel Schrittwieser, Daniel Tscharnuter, Daniel Kiener, Peter J. Imrich, and Verena Maier–Kiener. "From Nano-twinning to the Glide of Full Dislocations: Micropillar Compression Tests on Silicon Up to 900 °C." Materials & Design 258 (2025): N.PAG. https://doi.org/10.1016/j.matdes.2025.114730.

MLA (9th ed.) Citation

Schaffar, Gerald J.K., et al. "From Nano-twinning to the Glide of Full Dislocations: Micropillar Compression Tests on Silicon Up to 900 °C." Materials & Design, vol. 258, 2025, p. N.PAG, https://doi.org/10.1016/j.matdes.2025.114730.