APA (7th ed.) Citation

Lin, P., Wu, Z., Lee, Y., Chen, Z., Lin, T., Chen, P., & Duh, J. (2025). Grain refinement and interfacial IMCs suppression via Zn addition to enhance the mechanical properties of Cu/Sn-58Bi/Cu microbump. Journal of Materials Science: Materials in Electronics, 36(27), 1. https://doi.org/10.1007/s10854-025-15748-1

Chicago Style (17th ed.) Citation

Lin, Pin-Ling, Zih-You Wu, Yin-Ku Lee, Zi-Xu Chen, Ta-Wei Lin, Po-Yu Chen, and Jenq-Gong Duh. "Grain Refinement and Interfacial IMCs Suppression via Zn Addition to Enhance the Mechanical Properties of Cu/Sn-58Bi/Cu Microbump." Journal of Materials Science: Materials in Electronics 36, no. 27 (2025): 1. https://doi.org/10.1007/s10854-025-15748-1.

MLA (9th ed.) Citation

Lin, Pin-Ling, et al. "Grain Refinement and Interfacial IMCs Suppression via Zn Addition to Enhance the Mechanical Properties of Cu/Sn-58Bi/Cu Microbump." Journal of Materials Science: Materials in Electronics, vol. 36, no. 27, 2025, p. 1, https://doi.org/10.1007/s10854-025-15748-1.