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Grain refinement and interfacial IMCs suppression via Zn addition to enhance the mechanical properties of Cu/Sn-58Bi/Cu microbump.

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Title: Grain refinement and interfacial IMCs suppression via Zn addition to enhance the mechanical properties of Cu/Sn-58Bi/Cu microbump.
Authors: Lin, Pin-Ling1 (AUTHOR), Wu, Zih-You1 (AUTHOR), Lee, Yin-Ku1 (AUTHOR), Chen, Zi-Xu1 (AUTHOR), Lin, Ta-Wei1 (AUTHOR), Chen, Po-Yu1 (AUTHOR), Duh, Jenq-Gong1 (AUTHOR) jgd@mx.nthu.edu.tw
Source: Journal of Materials Science: Materials in Electronics. Sep2025, Vol. 36 Issue 27, p1-9. 9p.
Abstract: The continuous downscaling of microbump dimensions to sub-10 μm presents critical challenges to joint reliability in advanced electronic packaging. In such fine-pitch systems, applying low-temperature solders such as Sn-58Bi is considered to minimize thermal stress and ensure process compatibility. However, excessive growth of interfacial intermetallic compounds (IMCs), as well as the inherent brittleness and grain coarsening of Sn-58Bi solder, significantly degrade mechanical integrity. To address these limitations and improve mechanical properties, this study investigates the effect of Zn addition into Cu substrates on the microstructure and mechanical performance of Cu/Sn-58Bi/Cu microbumps. Doping Zn resulted in the formation of a Cu(Zn,Sn) layer, which served as a diffusion barrier to inhibit interfacial IMC growth. It also refined the eutectic microstructure through Zn diffusion into the solder. Shear tests revealed that Cu-36Zn/Sn-58Bi/Cu-36Zn samples exhibited improved mechanical performance compared to Cu/Sn-58Bi/Cu samples, with an increase of 20.5% in shear strength and 31.1% in energy absorption. Fracture analyses were also conducted to elucidate the mechanisms behind the strengthening effect of Zn. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Materials Science: Materials in Electronics is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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Header DbId: egs
DbLabel: Engineering Source
An: 188439317
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Grain refinement and interfacial IMCs suppression via Zn addition to enhance the mechanical properties of Cu/Sn-58Bi/Cu microbump.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Lin%2C+Pin-Ling%22">Lin, Pin-Ling</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Wu%2C+Zih-You%22">Wu, Zih-You</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Lee%2C+Yin-Ku%22">Lee, Yin-Ku</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Chen%2C+Zi-Xu%22">Chen, Zi-Xu</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Lin%2C+Ta-Wei%22">Lin, Ta-Wei</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Chen%2C+Po-Yu%22">Chen, Po-Yu</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Duh%2C+Jenq-Gong%22">Duh, Jenq-Gong</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> jgd@mx.nthu.edu.tw</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>. Sep2025, Vol. 36 Issue 27, p1-9. 9p.
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: The continuous downscaling of microbump dimensions to sub-10 μm presents critical challenges to joint reliability in advanced electronic packaging. In such fine-pitch systems, applying low-temperature solders such as Sn-58Bi is considered to minimize thermal stress and ensure process compatibility. However, excessive growth of interfacial intermetallic compounds (IMCs), as well as the inherent brittleness and grain coarsening of Sn-58Bi solder, significantly degrade mechanical integrity. To address these limitations and improve mechanical properties, this study investigates the effect of Zn addition into Cu substrates on the microstructure and mechanical performance of Cu/Sn-58Bi/Cu microbumps. Doping Zn resulted in the formation of a Cu(Zn,Sn) layer, which served as a diffusion barrier to inhibit interfacial IMC growth. It also refined the eutectic microstructure through Zn diffusion into the solder. Shear tests revealed that Cu-36Zn/Sn-58Bi/Cu-36Zn samples exhibited improved mechanical performance compared to Cu/Sn-58Bi/Cu samples, with an increase of 20.5% in shear strength and 31.1% in energy absorption. Fracture analyses were also conducted to elucidate the mechanisms behind the strengthening effect of Zn. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Journal of Materials Science: Materials in Electronics is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-025-15748-1
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 9
        StartPage: 1
    Titles:
      – TitleFull: Grain refinement and interfacial IMCs suppression via Zn addition to enhance the mechanical properties of Cu/Sn-58Bi/Cu microbump.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Lin, Pin-Ling
      – PersonEntity:
          Name:
            NameFull: Wu, Zih-You
      – PersonEntity:
          Name:
            NameFull: Lee, Yin-Ku
      – PersonEntity:
          Name:
            NameFull: Chen, Zi-Xu
      – PersonEntity:
          Name:
            NameFull: Lin, Ta-Wei
      – PersonEntity:
          Name:
            NameFull: Chen, Po-Yu
      – PersonEntity:
          Name:
            NameFull: Duh, Jenq-Gong
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 21
              M: 09
              Text: Sep2025
              Type: published
              Y: 2025
          Identifiers:
            – Type: issn-print
              Value: 09574522
          Numbering:
            – Type: volume
              Value: 36
            – Type: issue
              Value: 27
          Titles:
            – TitleFull: Journal of Materials Science: Materials in Electronics
              Type: main
ResultId 1