Grain refinement and interfacial IMCs suppression via Zn addition to enhance the mechanical properties of Cu/Sn-58Bi/Cu microbump. - Lin, Pin-Ling; Wu, Zih-You; Lee, Yin-Ku; Chen, Zi-Xu; Lin, Ta-Wei; Chen, Po-Yu; Duh, Jenq-Gong (Journal of Materials Science: Materials in Electronics, 2025)