APA (7th ed.) Citation

Back, G., Oh, S., Lee, D., & Kim, T. (2026). Predictive modeling of mixed abrasive slurry for enhanced performance in tungsten chemical mechanical polishing: A particle number concentration approach. Materials Science in Semiconductor Processing, 202, N.PAG. https://doi.org/10.1016/j.mssp.2025.110119

Chicago Style (17th ed.) Citation

Back, Geumji, Seungjun Oh, Dongho Lee, and Taesung Kim. "Predictive Modeling of Mixed Abrasive Slurry for Enhanced Performance in Tungsten Chemical Mechanical Polishing: A Particle Number Concentration Approach." Materials Science in Semiconductor Processing 202 (2026): N.PAG. https://doi.org/10.1016/j.mssp.2025.110119.

MLA (9th ed.) Citation

Back, Geumji, et al. "Predictive Modeling of Mixed Abrasive Slurry for Enhanced Performance in Tungsten Chemical Mechanical Polishing: A Particle Number Concentration Approach." Materials Science in Semiconductor Processing, vol. 202, 2026, p. N.PAG, https://doi.org/10.1016/j.mssp.2025.110119.