APA (7th ed.) Citation

Adler, M., Becker, K., Braun, T., Hoelck, O., Gaebler, A., Maass, U., . . . Schneider-Ramelow, M. (2025). HPC Packaging Platform Including Compression Molding. Journal of Microelectronic & Electronic Packaging, 22(3), 71. https://doi.org/10.4071/001c.143003

Chicago Style (17th ed.) Citation

Adler, M., et al. "HPC Packaging Platform Including Compression Molding." Journal of Microelectronic & Electronic Packaging 22, no. 3 (2025): 71. https://doi.org/10.4071/001c.143003.

MLA (9th ed.) Citation

Adler, M., et al. "HPC Packaging Platform Including Compression Molding." Journal of Microelectronic & Electronic Packaging, vol. 22, no. 3, 2025, p. 71, https://doi.org/10.4071/001c.143003.