APA (7th ed.) Citation

Tian, W., Wang, X., Feng, D., Li, X., Jin, Y., Li, H., & Liu, H. (2025). Amine-reactive Polymer Platform for Engineering Surface Modification of Next-generation Sequencing Chips. Chinese Journal of Polymer Science (Springer Science & Business Media B.V.), 43(11), 2030. https://doi.org/10.1007/s10118-025-3413-8

Chicago Style (17th ed.) Citation

Tian, Wei, Xin-Yuan Wang, Die-Wen Feng, Xiang-Qian Li, Yue-Kang Jin, Hui Li, and Hao Liu. "Amine-reactive Polymer Platform for Engineering Surface Modification of Next-generation Sequencing Chips." Chinese Journal of Polymer Science (Springer Science & Business Media B.V.) 43, no. 11 (2025): 2030. https://doi.org/10.1007/s10118-025-3413-8.

MLA (9th ed.) Citation

Tian, Wei, et al. "Amine-reactive Polymer Platform for Engineering Surface Modification of Next-generation Sequencing Chips." Chinese Journal of Polymer Science (Springer Science & Business Media B.V.), vol. 43, no. 11, 2025, p. 2030, https://doi.org/10.1007/s10118-025-3413-8.