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Laser sintering path effects on interfacial adhesion of inkjet-printed In2O3 films for thin-film thermocouples.

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Title: Laser sintering path effects on interfacial adhesion of inkjet-printed In2O3 films for thin-film thermocouples.
Authors: Han, Linjun1,2 (AUTHOR), Qiu, Lu2 (AUTHOR), Deng, Lingyun1 (AUTHOR), Song, Jianan3 (AUTHOR), Zhang, Shenghan3 (AUTHOR), Chen, Xiangyu2 (AUTHOR), Zhang, Xiaoyi2 (AUTHOR), Huang, Jia1 (AUTHOR) huangjia2019@csu.edu.cn
Source: Optics & Laser Technology. Jan2026:Part A, Vol. 193, pN.PAG-N.PAG. 1p.
Subjects: Laser sintering, Interfacial bonding, Thin film devices, Thermocouples, Microstructure, Indium oxide, Bond strengths, Temperature sensors
Abstract: Thin-film thermocouples (TFTCs) enable non-intrusive packaging designs, characterized by their compact structure, minimal environmental disturbance, high measurement accuracy, and microsecond-level transient response. These advantages make TFTCs highly promising for temperature monitoring on turbine blades of aero engines, both in terms of technical superiority and engineering applications. Indium oxide (In 2 O 3) and indium tin oxide (ITO) are widely used as functional layer materials for TFTCs due to their excellent thermoelectric response characteristics. However, existing thin-film fabrication processes are limited by weak film-substrate adhesion. To address this issue, this study employs inkjet printing to deposit In 2 O 3 films on ceramic substrates and systematically investigates the influence of laser sintering paths on film-substrate adhesion strength. A thermo-mechanical coupled finite element model is established to analyze the temperature and stress fields for different laser sintering paths. Based on simulation results, In 2 O 3 films were fabricated using various laser sintering strategies. The surface morphology and internal microstructure of the films were characterized, while nanoindentation and micro-scratch tests were conducted to evaluate the interfacial adhesion strength. Quantitatively, the maximum adhesion energy reached 11.4 mJ·mm−2 under the X-direction path, compared with 8.7 mJ·mm−2 and 7.3 mJ·mm−2 under the X-45°-direction path and Y-directions path, respectively, representing an improvement of nearly 55 % over the weakest orientation. The standard deviation of adhesion energy within the same group was below 5 %, indicating excellent process repeatability and reliability. Moreover, across five identically processed batches, the unit-length resistance was 73.96 ± 1.08 kΩ·cm−1, demonstrating high stability and reproducibility of the fabrication process. Finally, the physical mechanisms underlying the effects of laser sintering paths on the film's microstructure and interfacial bonding were revealed from the perspectives of temperature and stress distribution. This study provides new insights into optimizing the interfacial adhesion strength of inkjet-printed TFTCs. [ABSTRACT FROM AUTHOR]
Copyright of Optics & Laser Technology is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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DbLabel: Engineering Source
An: 189791332
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  Label: Title
  Group: Ti
  Data: Laser sintering path effects on interfacial adhesion of inkjet-printed In2O3 films for thin-film thermocouples.
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  Data: <searchLink fieldCode="AR" term="%22Han%2C+Linjun%22">Han, Linjun</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Qiu%2C+Lu%22">Qiu, Lu</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Deng%2C+Lingyun%22">Deng, Lingyun</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Song%2C+Jianan%22">Song, Jianan</searchLink><relatesTo>3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhang%2C+Shenghan%22">Zhang, Shenghan</searchLink><relatesTo>3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Chen%2C+Xiangyu%22">Chen, Xiangyu</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhang%2C+Xiaoyi%22">Zhang, Xiaoyi</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Huang%2C+Jia%22">Huang, Jia</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> huangjia2019@csu.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Optics+%26+Laser+Technology%22">Optics & Laser Technology</searchLink>. Jan2026:Part A, Vol. 193, pN.PAG-N.PAG. 1p.
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  Data: <searchLink fieldCode="DE" term="%22Laser+sintering%22">Laser sintering</searchLink><br /><searchLink fieldCode="DE" term="%22Interfacial+bonding%22">Interfacial bonding</searchLink><br /><searchLink fieldCode="DE" term="%22Thin+film+devices%22">Thin film devices</searchLink><br /><searchLink fieldCode="DE" term="%22Thermocouples%22">Thermocouples</searchLink><br /><searchLink fieldCode="DE" term="%22Microstructure%22">Microstructure</searchLink><br /><searchLink fieldCode="DE" term="%22Indium+oxide%22">Indium oxide</searchLink><br /><searchLink fieldCode="DE" term="%22Bond+strengths%22">Bond strengths</searchLink><br /><searchLink fieldCode="DE" term="%22Temperature+sensors%22">Temperature sensors</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Thin-film thermocouples (TFTCs) enable non-intrusive packaging designs, characterized by their compact structure, minimal environmental disturbance, high measurement accuracy, and microsecond-level transient response. These advantages make TFTCs highly promising for temperature monitoring on turbine blades of aero engines, both in terms of technical superiority and engineering applications. Indium oxide (In 2 O 3) and indium tin oxide (ITO) are widely used as functional layer materials for TFTCs due to their excellent thermoelectric response characteristics. However, existing thin-film fabrication processes are limited by weak film-substrate adhesion. To address this issue, this study employs inkjet printing to deposit In 2 O 3 films on ceramic substrates and systematically investigates the influence of laser sintering paths on film-substrate adhesion strength. A thermo-mechanical coupled finite element model is established to analyze the temperature and stress fields for different laser sintering paths. Based on simulation results, In 2 O 3 films were fabricated using various laser sintering strategies. The surface morphology and internal microstructure of the films were characterized, while nanoindentation and micro-scratch tests were conducted to evaluate the interfacial adhesion strength. Quantitatively, the maximum adhesion energy reached 11.4 mJ·mm−2 under the X-direction path, compared with 8.7 mJ·mm−2 and 7.3 mJ·mm−2 under the X-45°-direction path and Y-directions path, respectively, representing an improvement of nearly 55 % over the weakest orientation. The standard deviation of adhesion energy within the same group was below 5 %, indicating excellent process repeatability and reliability. Moreover, across five identically processed batches, the unit-length resistance was 73.96 ± 1.08 kΩ·cm−1, demonstrating high stability and reproducibility of the fabrication process. Finally, the physical mechanisms underlying the effects of laser sintering paths on the film's microstructure and interfacial bonding were revealed from the perspectives of temperature and stress distribution. This study provides new insights into optimizing the interfacial adhesion strength of inkjet-printed TFTCs. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Optics & Laser Technology is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1016/j.optlastec.2025.114253
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 1
        StartPage: N.PAG
    Subjects:
      – SubjectFull: Laser sintering
        Type: general
      – SubjectFull: Interfacial bonding
        Type: general
      – SubjectFull: Thin film devices
        Type: general
      – SubjectFull: Thermocouples
        Type: general
      – SubjectFull: Microstructure
        Type: general
      – SubjectFull: Indium oxide
        Type: general
      – SubjectFull: Bond strengths
        Type: general
      – SubjectFull: Temperature sensors
        Type: general
    Titles:
      – TitleFull: Laser sintering path effects on interfacial adhesion of inkjet-printed In2O3 films for thin-film thermocouples.
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            NameFull: Han, Linjun
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            – D: 01
              M: 01
              Text: Jan2026:Part A
              Type: published
              Y: 2026
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