Laser sintering path effects on interfacial adhesion of inkjet-printed In2O3 films for thin-film thermocouples.
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| Title: | Laser sintering path effects on interfacial adhesion of inkjet-printed In2O3 films for thin-film thermocouples. |
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| Authors: | Han, Linjun1,2 (AUTHOR), Qiu, Lu2 (AUTHOR), Deng, Lingyun1 (AUTHOR), Song, Jianan3 (AUTHOR), Zhang, Shenghan3 (AUTHOR), Chen, Xiangyu2 (AUTHOR), Zhang, Xiaoyi2 (AUTHOR), Huang, Jia1 (AUTHOR) huangjia2019@csu.edu.cn |
| Source: | Optics & Laser Technology. Jan2026:Part A, Vol. 193, pN.PAG-N.PAG. 1p. |
| Subjects: | Laser sintering, Interfacial bonding, Thin film devices, Thermocouples, Microstructure, Indium oxide, Bond strengths, Temperature sensors |
| Abstract: | Thin-film thermocouples (TFTCs) enable non-intrusive packaging designs, characterized by their compact structure, minimal environmental disturbance, high measurement accuracy, and microsecond-level transient response. These advantages make TFTCs highly promising for temperature monitoring on turbine blades of aero engines, both in terms of technical superiority and engineering applications. Indium oxide (In 2 O 3) and indium tin oxide (ITO) are widely used as functional layer materials for TFTCs due to their excellent thermoelectric response characteristics. However, existing thin-film fabrication processes are limited by weak film-substrate adhesion. To address this issue, this study employs inkjet printing to deposit In 2 O 3 films on ceramic substrates and systematically investigates the influence of laser sintering paths on film-substrate adhesion strength. A thermo-mechanical coupled finite element model is established to analyze the temperature and stress fields for different laser sintering paths. Based on simulation results, In 2 O 3 films were fabricated using various laser sintering strategies. The surface morphology and internal microstructure of the films were characterized, while nanoindentation and micro-scratch tests were conducted to evaluate the interfacial adhesion strength. Quantitatively, the maximum adhesion energy reached 11.4 mJ·mm−2 under the X-direction path, compared with 8.7 mJ·mm−2 and 7.3 mJ·mm−2 under the X-45°-direction path and Y-directions path, respectively, representing an improvement of nearly 55 % over the weakest orientation. The standard deviation of adhesion energy within the same group was below 5 %, indicating excellent process repeatability and reliability. Moreover, across five identically processed batches, the unit-length resistance was 73.96 ± 1.08 kΩ·cm−1, demonstrating high stability and reproducibility of the fabrication process. Finally, the physical mechanisms underlying the effects of laser sintering paths on the film's microstructure and interfacial bonding were revealed from the perspectives of temperature and stress distribution. This study provides new insights into optimizing the interfacial adhesion strength of inkjet-printed TFTCs. [ABSTRACT FROM AUTHOR] |
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| Database: | Engineering Source |
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