Advanced Electrochemical Plating Processes of Nano-Twinned Copper for Hybrid Bonding. - Jianwen Han; Pingping Ye; Braye, Stephan; ElSawy, Abdelhamid; Khanna, Harshul; Lambert, Veronica; Letize, Adam; Whitten, Kyle; Richardson, Thomas; Najjar, Elie (Advancing Microelectronics, 2025)