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Flow-field-driven control of coating uniformity in fowlp soft-bake chambers.

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Title: Flow-field-driven control of coating uniformity in fowlp soft-bake chambers.
Authors: Lee, Junyoung1 (AUTHOR), Hong, Joopyo2 (AUTHOR), Kim, Seungmo1 (AUTHOR) smkim@koreatecha.ac.kr
Source: Journal of Mechanical Science & Technology. Dec2025, Vol. 39 Issue 12, p7291-7305. 15p.
Subjects: Computational fluid dynamics, Wafer level packaging, Turbulence, Process capability, Fluid control, Semiconductor manufacturing
Abstract: Fan-out wafer-level packaging (FOWLP) requires precise flow-field control during the soft bake process to ensure coating uniformity and wafer yield. This study investigates the direct correlation between chamber hydrodynamics and photoresist film formation by combining computational fluid dynamics (CFD) simulations with experimental wafer fabrication. Chamber models with different inlet geometries—hole and slit—and the presence of baffles were analyzed using the realizable k–ε turbulence model. Experiments on 300 mm wafers produced ∼45 µm films, whose uniformity was evaluated through 3D contour mapping and six-sigma indices, including Cp, Cpk, Z-score, and DPMO. Furthermore, Pearson correlation and linear regression demonstrated statistically significant relationships (r > 0.9, p < 0.05) between flow uniformity and coating quality. Through this study, results revealed that the slit-with-baffle configuration achieved the most stable pressure and velocity distribution and superior process capability compared to other chambers. This work provides quantitative evidence that flow distribution strongly influences coating uniformity and offers practical design guidelines for next-generation wafer manufacturing. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Mechanical Science & Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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DbLabel: Engineering Source
An: 190277025
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PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Flow-field-driven control of coating uniformity in fowlp soft-bake chambers.
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  Data: Fan-out wafer-level packaging (FOWLP) requires precise flow-field control during the soft bake process to ensure coating uniformity and wafer yield. This study investigates the direct correlation between chamber hydrodynamics and photoresist film formation by combining computational fluid dynamics (CFD) simulations with experimental wafer fabrication. Chamber models with different inlet geometries—hole and slit—and the presence of baffles were analyzed using the realizable k–ε turbulence model. Experiments on 300 mm wafers produced ∼45 &#181;m films, whose uniformity was evaluated through 3D contour mapping and six-sigma indices, including Cp, Cpk, Z-score, and DPMO. Furthermore, Pearson correlation and linear regression demonstrated statistically significant relationships (r &gt; 0.9, p &lt; 0.05) between flow uniformity and coating quality. Through this study, results revealed that the slit-with-baffle configuration achieved the most stable pressure and velocity distribution and superior process capability compared to other chambers. This work provides quantitative evidence that flow distribution strongly influences coating uniformity and offers practical design guidelines for next-generation wafer manufacturing. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
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  Data: &lt;i&gt;Copyright of Journal of Mechanical Science &amp; Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder&#39;s express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.&lt;/i&gt; (Copyright applies to all Abstracts.)
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        Value: 10.1007/s12206-025-2512-3
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      – SubjectFull: Wafer level packaging
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      – SubjectFull: Turbulence
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      – SubjectFull: Process capability
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      – SubjectFull: Fluid control
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      – SubjectFull: Semiconductor manufacturing
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      – TitleFull: Flow-field-driven control of coating uniformity in fowlp soft-bake chambers.
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            NameFull: Lee, Junyoung
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            NameFull: Hong, Joopyo
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            – D: 01
              M: 12
              Text: Dec2025
              Type: published
              Y: 2025
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