APA (7th ed.) Citation

JUNHUI, H., HUI, Y., XIAOGE, C., & CHUANYUN, W. (2025). CU ELECTRODEPOSITION ON POLYPYRROLE PRECOAT FOR THE METALLIZATION OF PRINTED CIRCUIT BOARDS. Archives of Metallurgy & Materials, 70(4), 1905. https://doi.org/10.24425/amm.2025.156277

Chicago Style (17th ed.) Citation

JUNHUI, HU, Y. HUI, CH XIAOGE, and W. CHUANYUN. "CU ELECTRODEPOSITION ON POLYPYRROLE PRECOAT FOR THE METALLIZATION OF PRINTED CIRCUIT BOARDS." Archives of Metallurgy & Materials 70, no. 4 (2025): 1905. https://doi.org/10.24425/amm.2025.156277.

MLA (9th ed.) Citation

JUNHUI, HU, et al. "CU ELECTRODEPOSITION ON POLYPYRROLE PRECOAT FOR THE METALLIZATION OF PRINTED CIRCUIT BOARDS." Archives of Metallurgy & Materials, vol. 70, no. 4, 2025, p. 1905, https://doi.org/10.24425/amm.2025.156277.