CU ELECTRODEPOSITION ON POLYPYRROLE PRECOAT FOR THE METALLIZATION OF PRINTED CIRCUIT BOARDS.

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Bibliographic Details
Title:	CU ELECTRODEPOSITION ON POLYPYRROLE PRECOAT FOR THE METALLIZATION OF PRINTED CIRCUIT BOARDS.
Authors:	JUNHUI, HU¹, HUI, Y.¹, XIAOGE, CH.¹, CHUANYUN, W.¹ cywan@sit.edu.cn
Source:	Archives of Metallurgy & Materials. 2025, Vol. 70 Issue 4, p1905-1912. 8p.
Subjects:	Copper plating, Polypyrrole, Metalation, Circuit board manufacturing, Electroplating, Electrochemical experiments, Green technology, Printed circuits industry
Abstract:	To explore an alternative green metallization strategy for nonconductive plastics, a conductive polypyrrole (PPy) precoat was prepared by in-situ interfacial polymerization of pyrrole on printed circuit boards (PCBs) and the electrodeposition of Cu on PPy precoat was investigated using both voltage-controlled method and current-controlled method. A uniform PPy film was successfully obtained on the PCB surface through modifying the PCB wettability and optimizing the pyrrole solution. Electrochemical measurements showed that sufficient polarization was necessary for the electroreduction and growth of Cu crystals on the PPy precoat due to its high electrical resistance. The presence of through-holes adjacent to copper in PCB boards demonstrates that constant-current electroplating enables effective deposition of uniform, adherent copper layers on polypyrrole (PPy) - pretreated substrates, establishing a viable alternative to conventional electroless copper plating for through-hole metallization in PCB manufacturing. [ABSTRACT FROM AUTHOR]
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Database:	Engineering Source

Description
Abstract:	To explore an alternative green metallization strategy for nonconductive plastics, a conductive polypyrrole (PPy) precoat was prepared by in-situ interfacial polymerization of pyrrole on printed circuit boards (PCBs) and the electrodeposition of Cu on PPy precoat was investigated using both voltage-controlled method and current-controlled method. A uniform PPy film was successfully obtained on the PCB surface through modifying the PCB wettability and optimizing the pyrrole solution. Electrochemical measurements showed that sufficient polarization was necessary for the electroreduction and growth of Cu crystals on the PPy precoat due to its high electrical resistance. The presence of through-holes adjacent to copper in PCB boards demonstrates that constant-current electroplating enables effective deposition of uniform, adherent copper layers on polypyrrole (PPy) - pretreated substrates, establishing a viable alternative to conventional electroless copper plating for through-hole metallization in PCB manufacturing. [ABSTRACT FROM AUTHOR]
ISSN:	17333490
DOI:	10.24425/amm.2025.156277