CU ELECTRODEPOSITION ON POLYPYRROLE PRECOAT FOR THE METALLIZATION OF PRINTED CIRCUIT BOARDS.
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| Title: | CU ELECTRODEPOSITION ON POLYPYRROLE PRECOAT FOR THE METALLIZATION OF PRINTED CIRCUIT BOARDS. |
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| Authors: | JUNHUI, HU1, HUI, Y.1, XIAOGE, CH.1, CHUANYUN, W.1 cywan@sit.edu.cn |
| Source: | Archives of Metallurgy & Materials. 2025, Vol. 70 Issue 4, p1905-1912. 8p. |
| Subjects: | Copper plating, Polypyrrole, Metalation, Circuit board manufacturing, Electroplating, Electrochemical experiments, Green technology, Printed circuits industry |
| Abstract: | To explore an alternative green metallization strategy for nonconductive plastics, a conductive polypyrrole (PPy) precoat was prepared by in-situ interfacial polymerization of pyrrole on printed circuit boards (PCBs) and the electrodeposition of Cu on PPy precoat was investigated using both voltage-controlled method and current-controlled method. A uniform PPy film was successfully obtained on the PCB surface through modifying the PCB wettability and optimizing the pyrrole solution. Electrochemical measurements showed that sufficient polarization was necessary for the electroreduction and growth of Cu crystals on the PPy precoat due to its high electrical resistance. The presence of through-holes adjacent to copper in PCB boards demonstrates that constant-current electroplating enables effective deposition of uniform, adherent copper layers on polypyrrole (PPy) - pretreated substrates, establishing a viable alternative to conventional electroless copper plating for through-hole metallization in PCB manufacturing. [ABSTRACT FROM AUTHOR] |
| Copyright of Archives of Metallurgy & Materials is the property of Polish Academy of Sciences and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 190364986 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: CU ELECTRODEPOSITION ON POLYPYRROLE PRECOAT FOR THE METALLIZATION OF PRINTED CIRCUIT BOARDS. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22JUNHUI%2C+HU%22">JUNHUI, HU</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22HUI%2C+Y%2E%22">HUI, Y.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22XIAOGE%2C+CH%2E%22">XIAOGE, CH.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22CHUANYUN%2C+W%2E%22">CHUANYUN, W.</searchLink><relatesTo>1</relatesTo><i> cywan@sit.edu.cn</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Archives+of+Metallurgy+%26+Materials%22">Archives of Metallurgy & Materials</searchLink>. 2025, Vol. 70 Issue 4, p1905-1912. 8p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Copper+plating%22">Copper plating</searchLink><br /><searchLink fieldCode="DE" term="%22Polypyrrole%22">Polypyrrole</searchLink><br /><searchLink fieldCode="DE" term="%22Metalation%22">Metalation</searchLink><br /><searchLink fieldCode="DE" term="%22Circuit+board+manufacturing%22">Circuit board manufacturing</searchLink><br /><searchLink fieldCode="DE" term="%22Electroplating%22">Electroplating</searchLink><br /><searchLink fieldCode="DE" term="%22Electrochemical+experiments%22">Electrochemical experiments</searchLink><br /><searchLink fieldCode="DE" term="%22Green+technology%22">Green technology</searchLink><br /><searchLink fieldCode="DE" term="%22Printed+circuits+industry%22">Printed circuits industry</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: To explore an alternative green metallization strategy for nonconductive plastics, a conductive polypyrrole (PPy) precoat was prepared by in-situ interfacial polymerization of pyrrole on printed circuit boards (PCBs) and the electrodeposition of Cu on PPy precoat was investigated using both voltage-controlled method and current-controlled method. A uniform PPy film was successfully obtained on the PCB surface through modifying the PCB wettability and optimizing the pyrrole solution. Electrochemical measurements showed that sufficient polarization was necessary for the electroreduction and growth of Cu crystals on the PPy precoat due to its high electrical resistance. The presence of through-holes adjacent to copper in PCB boards demonstrates that constant-current electroplating enables effective deposition of uniform, adherent copper layers on polypyrrole (PPy) - pretreated substrates, establishing a viable alternative to conventional electroless copper plating for through-hole metallization in PCB manufacturing. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Archives of Metallurgy & Materials is the property of Polish Academy of Sciences and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.24425/amm.2025.156277 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 8 StartPage: 1905 Subjects: – SubjectFull: Copper plating Type: general – SubjectFull: Polypyrrole Type: general – SubjectFull: Metalation Type: general – SubjectFull: Circuit board manufacturing Type: general – SubjectFull: Electroplating Type: general – SubjectFull: Electrochemical experiments Type: general – SubjectFull: Green technology Type: general – SubjectFull: Printed circuits industry Type: general Titles: – TitleFull: CU ELECTRODEPOSITION ON POLYPYRROLE PRECOAT FOR THE METALLIZATION OF PRINTED CIRCUIT BOARDS. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: JUNHUI, HU – PersonEntity: Name: NameFull: HUI, Y. – PersonEntity: Name: NameFull: XIAOGE, CH. – PersonEntity: Name: NameFull: CHUANYUN, W. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 10 Text: 2025 Type: published Y: 2025 Identifiers: – Type: issn-print Value: 17333490 Numbering: – Type: volume Value: 70 – Type: issue Value: 4 Titles: – TitleFull: Archives of Metallurgy & Materials Type: main |
| ResultId | 1 |
