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Seed-mediated growth for aspect-ratio-tunable copper nanoplates.

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Title: Seed-mediated growth for aspect-ratio-tunable copper nanoplates.
Authors: Zhou, Yu1,2 (AUTHOR), Liang, Ying1 (AUTHOR) yliang@ecust.edu.cn, Fang, Bin1 (AUTHOR), Yuan, Shuanglong2 (AUTHOR), Zhang, Zhen1 (AUTHOR) zhangzhen@ecust.edu.cn
Source: CrystEngComm. 1/5/2026, Vol. 28 Issue 1, p197-206. 10p.
Subjects: Electric conductivity, Microelectronic packaging, Adhesives, Chemical synthesis, Nanocrystal synthesis, Nanostructured materials
Abstract: Copper materials with nanoplate structure combine the advantages of nano and micrometer dimensions, featuring excellent electrical conductivity, low-temperature sintering performance, and processability. They have considerable applicability and greater economic benefits compared with silver, and thus have attracted much attention in the field of microelectronic packaging. In this study, a seed-mediated growth method was proposed to synthesize copper nanoplates (Cu NPs) under mild conditions. By selecting pre-synthesized silver nanoplates as seeds, the synthetic efficiency and dimensional controllability of Cu NPs have been greatly improved. At 40 °C, Cu NPs with good dispersion can be obtained within 15 min. The formation mechanism of Cu NPs was proposed by studying the factors that influence it. The conductive adhesives formulated with as-synthesized Cu NPs achieve an impressively low resistivity of 35 μΩ cm at a filler content of 90 wt%, paving the way for the industrial application of copper-based conductive adhesives. [ABSTRACT FROM AUTHOR]
Copyright of CrystEngComm is the property of Royal Society of Chemistry and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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DbLabel: Engineering Source
An: 190662256
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Seed-mediated growth for aspect-ratio-tunable copper nanoplates.
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  Data: <searchLink fieldCode="AR" term="%22Zhou%2C+Yu%22">Zhou, Yu</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Liang%2C+Ying%22">Liang, Ying</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> yliang@ecust.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Fang%2C+Bin%22">Fang, Bin</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Yuan%2C+Shuanglong%22">Yuan, Shuanglong</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhang%2C+Zhen%22">Zhang, Zhen</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> zhangzhen@ecust.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22CrystEngComm%22">CrystEngComm</searchLink>. 1/5/2026, Vol. 28 Issue 1, p197-206. 10p.
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  Data: <searchLink fieldCode="DE" term="%22Electric+conductivity%22">Electric conductivity</searchLink><br /><searchLink fieldCode="DE" term="%22Microelectronic+packaging%22">Microelectronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Adhesives%22">Adhesives</searchLink><br /><searchLink fieldCode="DE" term="%22Chemical+synthesis%22">Chemical synthesis</searchLink><br /><searchLink fieldCode="DE" term="%22Nanocrystal+synthesis%22">Nanocrystal synthesis</searchLink><br /><searchLink fieldCode="DE" term="%22Nanostructured+materials%22">Nanostructured materials</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Copper materials with nanoplate structure combine the advantages of nano and micrometer dimensions, featuring excellent electrical conductivity, low-temperature sintering performance, and processability. They have considerable applicability and greater economic benefits compared with silver, and thus have attracted much attention in the field of microelectronic packaging. In this study, a seed-mediated growth method was proposed to synthesize copper nanoplates (Cu NPs) under mild conditions. By selecting pre-synthesized silver nanoplates as seeds, the synthetic efficiency and dimensional controllability of Cu NPs have been greatly improved. At 40 °C, Cu NPs with good dispersion can be obtained within 15 min. The formation mechanism of Cu NPs was proposed by studying the factors that influence it. The conductive adhesives formulated with as-synthesized Cu NPs achieve an impressively low resistivity of 35 μΩ cm at a filler content of 90 wt%, paving the way for the industrial application of copper-based conductive adhesives. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of CrystEngComm is the property of Royal Society of Chemistry and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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      – Type: doi
        Value: 10.1039/d5ce01031d
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      – Code: eng
        Text: English
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        PageCount: 10
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      – SubjectFull: Electric conductivity
        Type: general
      – SubjectFull: Microelectronic packaging
        Type: general
      – SubjectFull: Adhesives
        Type: general
      – SubjectFull: Chemical synthesis
        Type: general
      – SubjectFull: Nanocrystal synthesis
        Type: general
      – SubjectFull: Nanostructured materials
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      – TitleFull: Seed-mediated growth for aspect-ratio-tunable copper nanoplates.
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            NameFull: Zhou, Yu
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            NameFull: Fang, Bin
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            – D: 05
              M: 01
              Text: 1/5/2026
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              Y: 2026
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