Texture and Flexural Fatigue Resistance Governed by Surface-Dependent Deformation and Recrystallization in the Copper Foils.
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| Title: | Texture and Flexural Fatigue Resistance Governed by Surface-Dependent Deformation and Recrystallization in the Copper Foils. |
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| Authors: | Wu, Tong1 (AUTHOR), Liu, Guohao1 (AUTHOR), Liu, Di1 (AUTHOR), Wang, Bingxing1 (AUTHOR) wangbx@ral.neu.edu.cn, Wang, Bin1 (AUTHOR), Tian, Yong1 (AUTHOR) |
| Source: | Nanomaterials (2079-4991). Jan2026, Vol. 15 Issue 1, p11. 17p. |
| Subjects: | Copper foil, Flexure, Fatigue limit, Flexible electronics, Deformation of surfaces, Microstructure, Grain size, Recrystallization (Metallurgy) |
| Abstract: | High-flexibility copper foils are critical for reliable flexible interconnects and displays. In this work, commercial-purity copper belts were processed by triple-layer stacked cold rolling to ultrathin foils, producing distinct surface- and layer-dependent deformation structures in the bright, matte, and central-interface layers; subsequent annealing at 600 °C then promoted orientation-selective recrystallization. Under the present conditions, the center-interface layer of the triple-rolled foil achieved the highest flexural-fatigue life (≈8.0 × 104 cycles) within a window of cube ≈ 30–45% and grain size ≈ 40–60 μm. In this regime, grain-size control stabilizes intergranular slip compatibility, reduces elastic–plastic mismatch, and mitigates strain localization during cyclic bending. Even without aggressive cube enrichment, high flexural fatigue resistance can likewise be achieved through deliberate control of grain size. These findings establish a clear processing–microstructure–property linkage and indicate that layer-dependent control of texture and grain size can enhance flexural-fatigue performance in triple-layer stacked-rolled copper foils for flexible electronics. [ABSTRACT FROM AUTHOR] |
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| Database: | Engineering Source |
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| Abstract: | High-flexibility copper foils are critical for reliable flexible interconnects and displays. In this work, commercial-purity copper belts were processed by triple-layer stacked cold rolling to ultrathin foils, producing distinct surface- and layer-dependent deformation structures in the bright, matte, and central-interface layers; subsequent annealing at 600 °C then promoted orientation-selective recrystallization. Under the present conditions, the center-interface layer of the triple-rolled foil achieved the highest flexural-fatigue life (≈8.0 × 104 cycles) within a window of cube ≈ 30–45% and grain size ≈ 40–60 μm. In this regime, grain-size control stabilizes intergranular slip compatibility, reduces elastic–plastic mismatch, and mitigates strain localization during cyclic bending. Even without aggressive cube enrichment, high flexural fatigue resistance can likewise be achieved through deliberate control of grain size. These findings establish a clear processing–microstructure–property linkage and indicate that layer-dependent control of texture and grain size can enhance flexural-fatigue performance in triple-layer stacked-rolled copper foils for flexible electronics. [ABSTRACT FROM AUTHOR] |
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| ISSN: | 20794991 |
| DOI: | 10.3390/nano16010011 |
