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Texture and Flexural Fatigue Resistance Governed by Surface-Dependent Deformation and Recrystallization in the Copper Foils.

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Title: Texture and Flexural Fatigue Resistance Governed by Surface-Dependent Deformation and Recrystallization in the Copper Foils.
Authors: Wu, Tong1 (AUTHOR), Liu, Guohao1 (AUTHOR), Liu, Di1 (AUTHOR), Wang, Bingxing1 (AUTHOR) wangbx@ral.neu.edu.cn, Wang, Bin1 (AUTHOR), Tian, Yong1 (AUTHOR)
Source: Nanomaterials (2079-4991). Jan2026, Vol. 15 Issue 1, p11. 17p.
Subjects: Copper foil, Flexure, Fatigue limit, Flexible electronics, Deformation of surfaces, Microstructure, Grain size, Recrystallization (Metallurgy)
Abstract: High-flexibility copper foils are critical for reliable flexible interconnects and displays. In this work, commercial-purity copper belts were processed by triple-layer stacked cold rolling to ultrathin foils, producing distinct surface- and layer-dependent deformation structures in the bright, matte, and central-interface layers; subsequent annealing at 600 °C then promoted orientation-selective recrystallization. Under the present conditions, the center-interface layer of the triple-rolled foil achieved the highest flexural-fatigue life (≈8.0 × 104 cycles) within a window of cube ≈ 30–45% and grain size ≈ 40–60 μm. In this regime, grain-size control stabilizes intergranular slip compatibility, reduces elastic–plastic mismatch, and mitigates strain localization during cyclic bending. Even without aggressive cube enrichment, high flexural fatigue resistance can likewise be achieved through deliberate control of grain size. These findings establish a clear processing–microstructure–property linkage and indicate that layer-dependent control of texture and grain size can enhance flexural-fatigue performance in triple-layer stacked-rolled copper foils for flexible electronics. [ABSTRACT FROM AUTHOR]
Copyright of Nanomaterials (2079-4991) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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  Data: Texture and Flexural Fatigue Resistance Governed by Surface-Dependent Deformation and Recrystallization in the Copper Foils.
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  Data: <searchLink fieldCode="JN" term="%22Nanomaterials+%282079-4991%29%22">Nanomaterials (2079-4991)</searchLink>. Jan2026, Vol. 15 Issue 1, p11. 17p.
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  Data: <searchLink fieldCode="DE" term="%22Copper+foil%22">Copper foil</searchLink><br /><searchLink fieldCode="DE" term="%22Flexure%22">Flexure</searchLink><br /><searchLink fieldCode="DE" term="%22Fatigue+limit%22">Fatigue limit</searchLink><br /><searchLink fieldCode="DE" term="%22Flexible+electronics%22">Flexible electronics</searchLink><br /><searchLink fieldCode="DE" term="%22Deformation+of+surfaces%22">Deformation of surfaces</searchLink><br /><searchLink fieldCode="DE" term="%22Microstructure%22">Microstructure</searchLink><br /><searchLink fieldCode="DE" term="%22Grain+size%22">Grain size</searchLink><br /><searchLink fieldCode="DE" term="%22Recrystallization+%28Metallurgy%29%22">Recrystallization (Metallurgy)</searchLink>
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  Label: Abstract
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  Data: High-flexibility copper foils are critical for reliable flexible interconnects and displays. In this work, commercial-purity copper belts were processed by triple-layer stacked cold rolling to ultrathin foils, producing distinct surface- and layer-dependent deformation structures in the bright, matte, and central-interface layers; subsequent annealing at 600 °C then promoted orientation-selective recrystallization. Under the present conditions, the center-interface layer of the triple-rolled foil achieved the highest flexural-fatigue life (≈8.0 × 104 cycles) within a window of cube ≈ 30–45% and grain size ≈ 40–60 μm. In this regime, grain-size control stabilizes intergranular slip compatibility, reduces elastic–plastic mismatch, and mitigates strain localization during cyclic bending. Even without aggressive cube enrichment, high flexural fatigue resistance can likewise be achieved through deliberate control of grain size. These findings establish a clear processing–microstructure–property linkage and indicate that layer-dependent control of texture and grain size can enhance flexural-fatigue performance in triple-layer stacked-rolled copper foils for flexible electronics. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Nanomaterials (2079-4991) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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      – Type: doi
        Value: 10.3390/nano16010011
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      – Code: eng
        Text: English
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        PageCount: 17
        StartPage: 11
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      – SubjectFull: Copper foil
        Type: general
      – SubjectFull: Flexure
        Type: general
      – SubjectFull: Fatigue limit
        Type: general
      – SubjectFull: Flexible electronics
        Type: general
      – SubjectFull: Deformation of surfaces
        Type: general
      – SubjectFull: Microstructure
        Type: general
      – SubjectFull: Grain size
        Type: general
      – SubjectFull: Recrystallization (Metallurgy)
        Type: general
    Titles:
      – TitleFull: Texture and Flexural Fatigue Resistance Governed by Surface-Dependent Deformation and Recrystallization in the Copper Foils.
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            NameFull: Wu, Tong
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            NameFull: Liu, Guohao
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            NameFull: Liu, Di
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            NameFull: Wang, Bingxing
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            NameFull: Wang, Bin
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            – D: 01
              M: 01
              Text: Jan2026
              Type: published
              Y: 2026
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