Bibliographic Details
| Title: |
Microstructure of Cu-Graphite@Ti2SnC Composites. |
| Authors: |
Zhang, Xiaozu1,2 (AUTHOR) xzzhang123@suda.edu.cn, Zhou, Pengfei3 (AUTHOR) zpfjsyc@126.com, Wang, Zhixiu4 (AUTHOR) |
| Source: |
JOM: The Journal of The Minerals, Metals & Materials Society (TMS). Feb2026, Vol. 78 Issue 2, p1368-1376. 9p. |
| Subjects: |
Graphite composites, Interfacial bonding, Electrical conductors, Energy dissipation, Metal-metal bonds, Transition metal carbides, Lubrication systems, Sintering |
| Abstract: |
Cu-graphite composites (CGC) are used in various applications, such as heat dissipation, lubrication, and electrical contact materials. However, the weak interface bonding between graphite and Cu significantly limits the performance of these composites. To improve the interface bonding and explore new approaches, this study employs an in situ fabrication method to prepare a Ti2SnC-modified layer on the surface of graphite particles, followed by coating Cu onto the Ti2SnC-modified layer. Further, the Cu-coated Ti2SnC-modified graphite powder was used as the raw material for composite preparation via vacuum hot-press sintering. The results show that the Ti2SnC-modified layer on the graphite surface and Cu can undergo mutual diffusion during sintering, forming a metallurgical bond. Ultimately, the Ti2SnC-modified layer facilitates the bonding between graphite and Cu, which is chemical-metallurgical. [ABSTRACT FROM AUTHOR] |
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| Database: |
Engineering Source |
