Microstructure of Cu-Graphite@Ti2SnC Composites.

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Title: Microstructure of Cu-Graphite@Ti2SnC Composites.
Authors: Zhang, Xiaozu1,2 (AUTHOR) xzzhang123@suda.edu.cn, Zhou, Pengfei3 (AUTHOR) zpfjsyc@126.com, Wang, Zhixiu4 (AUTHOR)
Source: JOM: The Journal of The Minerals, Metals & Materials Society (TMS). Feb2026, Vol. 78 Issue 2, p1368-1376. 9p.
Subjects: Graphite composites, Interfacial bonding, Electrical conductors, Energy dissipation, Metal-metal bonds, Transition metal carbides, Lubrication systems, Sintering
Abstract: Cu-graphite composites (CGC) are used in various applications, such as heat dissipation, lubrication, and electrical contact materials. However, the weak interface bonding between graphite and Cu significantly limits the performance of these composites. To improve the interface bonding and explore new approaches, this study employs an in situ fabrication method to prepare a Ti2SnC-modified layer on the surface of graphite particles, followed by coating Cu onto the Ti2SnC-modified layer. Further, the Cu-coated Ti2SnC-modified graphite powder was used as the raw material for composite preparation via vacuum hot-press sintering. The results show that the Ti2SnC-modified layer on the graphite surface and Cu can undergo mutual diffusion during sintering, forming a metallurgical bond. Ultimately, the Ti2SnC-modified layer facilitates the bonding between graphite and Cu, which is chemical-metallurgical. [ABSTRACT FROM AUTHOR]
Copyright of JOM: The Journal of The Minerals, Metals & Materials Society (TMS) is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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DbLabel: Engineering Source
An: 190888620
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  Label: Title
  Group: Ti
  Data: Microstructure of Cu-Graphite@Ti<subscript>2</subscript>SnC Composites.
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  Data: <searchLink fieldCode="AR" term="%22Zhang%2C+Xiaozu%22">Zhang, Xiaozu</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<i> xzzhang123@suda.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Zhou%2C+Pengfei%22">Zhou, Pengfei</searchLink><relatesTo>3</relatesTo> (AUTHOR)<i> zpfjsyc@126.com</i><br /><searchLink fieldCode="AR" term="%22Wang%2C+Zhixiu%22">Wang, Zhixiu</searchLink><relatesTo>4</relatesTo> (AUTHOR)
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  Data: <searchLink fieldCode="JN" term="%22JOM%3A+The+Journal+of+The+Minerals%2C+Metals+%26+Materials+Society+%28TMS%29%22">JOM: The Journal of The Minerals, Metals & Materials Society (TMS)</searchLink>. Feb2026, Vol. 78 Issue 2, p1368-1376. 9p.
– Name: Subject
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  Data: <searchLink fieldCode="DE" term="%22Graphite+composites%22">Graphite composites</searchLink><br /><searchLink fieldCode="DE" term="%22Interfacial+bonding%22">Interfacial bonding</searchLink><br /><searchLink fieldCode="DE" term="%22Electrical+conductors%22">Electrical conductors</searchLink><br /><searchLink fieldCode="DE" term="%22Energy+dissipation%22">Energy dissipation</searchLink><br /><searchLink fieldCode="DE" term="%22Metal-metal+bonds%22">Metal-metal bonds</searchLink><br /><searchLink fieldCode="DE" term="%22Transition+metal+carbides%22">Transition metal carbides</searchLink><br /><searchLink fieldCode="DE" term="%22Lubrication+systems%22">Lubrication systems</searchLink><br /><searchLink fieldCode="DE" term="%22Sintering%22">Sintering</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Cu-graphite composites (CGC) are used in various applications, such as heat dissipation, lubrication, and electrical contact materials. However, the weak interface bonding between graphite and Cu significantly limits the performance of these composites. To improve the interface bonding and explore new approaches, this study employs an in situ fabrication method to prepare a Ti2SnC-modified layer on the surface of graphite particles, followed by coating Cu onto the Ti2SnC-modified layer. Further, the Cu-coated Ti2SnC-modified graphite powder was used as the raw material for composite preparation via vacuum hot-press sintering. The results show that the Ti2SnC-modified layer on the graphite surface and Cu can undergo mutual diffusion during sintering, forming a metallurgical bond. Ultimately, the Ti2SnC-modified layer facilitates the bonding between graphite and Cu, which is chemical-metallurgical. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of JOM: The Journal of The Minerals, Metals & Materials Society (TMS) is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1007/s11837-025-07924-9
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 9
        StartPage: 1368
    Subjects:
      – SubjectFull: Graphite composites
        Type: general
      – SubjectFull: Interfacial bonding
        Type: general
      – SubjectFull: Electrical conductors
        Type: general
      – SubjectFull: Energy dissipation
        Type: general
      – SubjectFull: Metal-metal bonds
        Type: general
      – SubjectFull: Transition metal carbides
        Type: general
      – SubjectFull: Lubrication systems
        Type: general
      – SubjectFull: Sintering
        Type: general
    Titles:
      – TitleFull: Microstructure of Cu-Graphite@Ti2SnC Composites.
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            NameFull: Zhang, Xiaozu
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            NameFull: Zhou, Pengfei
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            NameFull: Wang, Zhixiu
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            – D: 01
              M: 02
              Text: Feb2026
              Type: published
              Y: 2026
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              Value: 78
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