APA (7th ed.) Citation

Wang, B., Ke, Z., Chen, Z., Li, W., Huang, W., He, S., . . . Nishikawa, H. (2026). Size effect on shear performance of microscale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under current stressing. Soldering & Surface Mount Technology, 38(2), 156.

Chicago Style (17th ed.) Citation

Wang, Bo, Zhanglong Ke, Zimeng Chen, Wangyun Li, Wei Huang, Siliang He, Kailin Pan, and Hiroshi Nishikawa. "Size Effect on Shear Performance of Microscale Ball Grid Array Structure Cu/Sn-3.0Ag-0.5Cu/Cu Solder Joints Under Current Stressing." Soldering & Surface Mount Technology 38, no. 2 (2026): 156.

MLA (9th ed.) Citation

Wang, Bo, et al. "Size Effect on Shear Performance of Microscale Ball Grid Array Structure Cu/Sn-3.0Ag-0.5Cu/Cu Solder Joints Under Current Stressing." Soldering & Surface Mount Technology, vol. 38, no. 2, 2026, p. 156.