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Size effect on shear performance of microscale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under current stressing.

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Title: Size effect on shear performance of microscale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under current stressing.
Authors: Wang, Bo1 (AUTHOR) wangbo_guet@163.com, Ke, Zhanglong1 (AUTHOR) 2651942289@qq.com, Chen, Zimeng1 (AUTHOR) 2313914573@qq.com, Li, Wangyun1 (AUTHOR) li.wangyun@swjtu.edu.cn, Huang, Wei1 (AUTHOR) 16980673@qq.com, He, Siliang1 (AUTHOR) li.wangyun@swjtu.edu.cn, Pan, Kailin1 (AUTHOR) pankl@guet.edu.cn, Nishikawa, Hiroshi2 (AUTHOR) nisikawa.jwri@osaka-u.ac.jp
Source: Soldering & Surface Mount Technology. 2026, Vol. 38 Issue 2, p156-172. 17p.
Subjects: Shear strength, Solder joints, Ball grid array technology, Mechanical behavior of materials, Finite element method, Intermetallic compounds, Fracture mechanics
Abstract: Purpose: The purpose of this study is to explore the size effect on shear mechanical behavior of microscale ball grid array (BGA) structure Cu/SAC305/Cu solder joints with different heights under current stressing, and to reveal the influence mechanism of current and solder joint's height on shear performance and fracture behavior. Design/methodology/approach: A dynamic mechanical analyzer was used in conjunction with a constant current power supply to conduct shear mechanical testing of solder joints under current stressing with current densities from 6.0 × 103 to 1.1 × 104 A/cm2. Meanwhile, temperature, current density, stress and strain distribution in solder joint are analyzed in combination with finite element simulation to further reveal the evolution mechanism of mechanical behavior of solder joint. Findings: This study reveals that the shear size effect in solder joints originates from the weakened constraint effect of the intermetallic compound (IMC)/substrate interface on the solder matrix with increase of joint height. Furthermore, incorporating in situ current stressing demonstrates that greater joint height leads to greater heat accumulation at identical current densities, resulting in monotonic degradation of shear strength with greater joint height. Simultaneously, greater joint height intensifies current crowding and strain mismatch at the solder/IMC interface, promoting interfacial fracture. These findings are rigorously supported by decline-rate trends and a finite element (FE)-validated simulation mechanism chain (including stress triaxiality, temperature, current density and stress/strain fields), establishing quantitative thresholds for interfacial fracture initiation. Originality/value: This study extends previous research on shear size effect of solder joints by incorporating in situ current stressing. The coupling influence of joint height and current stressing was revealed by a FE-validated mechanism chain, and relevant quantitative thresholds was established, providing critical data and theoretical support for evaluating the reliability of microscale BGA-structured solder joints under current stressing. [ABSTRACT FROM AUTHOR]
Copyright of Soldering & Surface Mount Technology is the property of Emerald Publishing Limited and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 191326610
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Size effect on shear performance of microscale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under current stressing.
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  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Wang%2C+Bo%22">Wang, Bo</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> wangbo_guet@163.com</i><br /><searchLink fieldCode="AR" term="%22Ke%2C+Zhanglong%22">Ke, Zhanglong</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> 2651942289@qq.com</i><br /><searchLink fieldCode="AR" term="%22Chen%2C+Zimeng%22">Chen, Zimeng</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> 2313914573@qq.com</i><br /><searchLink fieldCode="AR" term="%22Li%2C+Wangyun%22">Li, Wangyun</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> li.wangyun@swjtu.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Huang%2C+Wei%22">Huang, Wei</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> 16980673@qq.com</i><br /><searchLink fieldCode="AR" term="%22He%2C+Siliang%22">He, Siliang</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> li.wangyun@swjtu.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Pan%2C+Kailin%22">Pan, Kailin</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> pankl@guet.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Nishikawa%2C+Hiroshi%22">Nishikawa, Hiroshi</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> nisikawa.jwri@osaka-u.ac.jp</i>
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  Data: <searchLink fieldCode="JN" term="%22Soldering+%26+Surface+Mount+Technology%22">Soldering & Surface Mount Technology</searchLink>. 2026, Vol. 38 Issue 2, p156-172. 17p.
– Name: Subject
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  Data: <searchLink fieldCode="DE" term="%22Shear+strength%22">Shear strength</searchLink><br /><searchLink fieldCode="DE" term="%22Solder+joints%22">Solder joints</searchLink><br /><searchLink fieldCode="DE" term="%22Ball+grid+array+technology%22">Ball grid array technology</searchLink><br /><searchLink fieldCode="DE" term="%22Mechanical+behavior+of+materials%22">Mechanical behavior of materials</searchLink><br /><searchLink fieldCode="DE" term="%22Finite+element+method%22">Finite element method</searchLink><br /><searchLink fieldCode="DE" term="%22Intermetallic+compounds%22">Intermetallic compounds</searchLink><br /><searchLink fieldCode="DE" term="%22Fracture+mechanics%22">Fracture mechanics</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Purpose: The purpose of this study is to explore the size effect on shear mechanical behavior of microscale ball grid array (BGA) structure Cu/SAC305/Cu solder joints with different heights under current stressing, and to reveal the influence mechanism of current and solder joint's height on shear performance and fracture behavior. Design/methodology/approach: A dynamic mechanical analyzer was used in conjunction with a constant current power supply to conduct shear mechanical testing of solder joints under current stressing with current densities from 6.0 × 103 to 1.1 × 104 A/cm2. Meanwhile, temperature, current density, stress and strain distribution in solder joint are analyzed in combination with finite element simulation to further reveal the evolution mechanism of mechanical behavior of solder joint. Findings: This study reveals that the shear size effect in solder joints originates from the weakened constraint effect of the intermetallic compound (IMC)/substrate interface on the solder matrix with increase of joint height. Furthermore, incorporating in situ current stressing demonstrates that greater joint height leads to greater heat accumulation at identical current densities, resulting in monotonic degradation of shear strength with greater joint height. Simultaneously, greater joint height intensifies current crowding and strain mismatch at the solder/IMC interface, promoting interfacial fracture. These findings are rigorously supported by decline-rate trends and a finite element (FE)-validated simulation mechanism chain (including stress triaxiality, temperature, current density and stress/strain fields), establishing quantitative thresholds for interfacial fracture initiation. Originality/value: This study extends previous research on shear size effect of solder joints by incorporating in situ current stressing. The coupling influence of joint height and current stressing was revealed by a FE-validated mechanism chain, and relevant quantitative thresholds was established, providing critical data and theoretical support for evaluating the reliability of microscale BGA-structured solder joints under current stressing. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Soldering & Surface Mount Technology is the property of Emerald Publishing Limited and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 17
        StartPage: 156
    Subjects:
      – SubjectFull: Shear strength
        Type: general
      – SubjectFull: Solder joints
        Type: general
      – SubjectFull: Ball grid array technology
        Type: general
      – SubjectFull: Mechanical behavior of materials
        Type: general
      – SubjectFull: Finite element method
        Type: general
      – SubjectFull: Intermetallic compounds
        Type: general
      – SubjectFull: Fracture mechanics
        Type: general
    Titles:
      – TitleFull: Size effect on shear performance of microscale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under current stressing.
        Type: main
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          Name:
            NameFull: Wang, Bo
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            NameFull: Ke, Zhanglong
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            NameFull: Chen, Zimeng
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            NameFull: Li, Wangyun
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            NameFull: Huang, Wei
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            NameFull: He, Siliang
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            NameFull: Pan, Kailin
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            NameFull: Nishikawa, Hiroshi
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            – D: 01
              M: 03
              Text: 2026
              Type: published
              Y: 2026
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              Value: 38
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            – TitleFull: Soldering & Surface Mount Technology
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