Size effect on shear performance of microscale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under current stressing. - Wang, Bo; Ke, Zhanglong; Chen, Zimeng; Li, Wangyun; Huang, Wei; He, Siliang; Pan, Kailin; Nishikawa, Hiroshi (Soldering & Surface Mount Technology, 2026)