Yang, F., Chen, L., & Ho, C. (2026). Artificial neural network-driven diffraction imaging for nanoscale optical critical dimension metrology in semiconductor microstructures. International Journal of Advanced Manufacturing Technology, 142(7/8), 3499. https://doi.org/10.1007/s00170-025-17343-4
Chicago Style (17th ed.) CitationYang, Fu-Sheng, Liang-Chia Chen, and Chao-Ching Ho. "Artificial Neural Network-driven Diffraction Imaging for Nanoscale Optical Critical Dimension Metrology in Semiconductor Microstructures." International Journal of Advanced Manufacturing Technology 142, no. 7/8 (2026): 3499. https://doi.org/10.1007/s00170-025-17343-4.
MLA (9th ed.) CitationYang, Fu-Sheng, et al. "Artificial Neural Network-driven Diffraction Imaging for Nanoscale Optical Critical Dimension Metrology in Semiconductor Microstructures." International Journal of Advanced Manufacturing Technology, vol. 142, no. 7/8, 2026, p. 3499, https://doi.org/10.1007/s00170-025-17343-4.