Chugunov, E. Y., Timoshenkov, S. P., & Pogalov, A. I. (2025). Development and Research on Multichip Microsystems Based on Modular Three-Dimensional Integration of Chips. Russian Microelectronics, 54(7), 781. https://doi.org/10.1134/S1063739725700155
Chicago Style (17th ed.) CitationChugunov, E. Yu., S. P. Timoshenkov, and A. I. Pogalov. "Development and Research on Multichip Microsystems Based on Modular Three-Dimensional Integration of Chips." Russian Microelectronics 54, no. 7 (2025): 781. https://doi.org/10.1134/S1063739725700155.
MLA (9th ed.) CitationChugunov, E. Yu., et al. "Development and Research on Multichip Microsystems Based on Modular Three-Dimensional Integration of Chips." Russian Microelectronics, vol. 54, no. 7, 2025, p. 781, https://doi.org/10.1134/S1063739725700155.