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Development and Research on Multichip Microsystems Based on Modular Three-Dimensional Integration of Chips.

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Title: Development and Research on Multichip Microsystems Based on Modular Three-Dimensional Integration of Chips.
Authors: Chugunov, E. Yu.1 (AUTHOR) dtm@miee.ru, Timoshenkov, S. P.1 (AUTHOR), Pogalov, A. I.1 (AUTHOR)
Source: Russian Microelectronics. Dec2025, Vol. 54 Issue 7, p781-786. 6p.
Subjects: Multichip modules (Microelectronics), Finite element method, Modular design, Mechanical behavior of materials, Durability, Thermal resistance
Abstract: The approach to create a highly-integrated electronic component base (ECB) based on three-dimensional (3D) multichip microsystems (MCMs) is progressing intensely and is being implemented in areas such as multilevel packaging of packaged microchips, unpackaged microchips, and semiconductor structures. This approach involves stacking a set of chips in 3D multichip modules and has a variety of advantages compared to 2D-constructions due to the greater functional density and efficiency of chip placement and assembly. In this paper, studies of MCMs on exposure to various influencing factors are carried out. The significant impact of the materials' physical and mechanical properties, as well as structural-and-technological solutions, on product strength is shown. It is established that ensuring the reliability of the electronic component base under formation, targeted at reducing the number of failures and damage, as well as increasing resistance to mechanical, temperature, and other actions, is assured by observing the set of developed scientific and technical recommendations. A criterion of evaluating the durability of conductors, taking into account the linear hardening of the material and plastic strain in the loading cycle, is developed. A comprehensive engineering calculation with simulation based on the finite-element method allows considering the totality of the structural, technological, and operational aspects of the development of the ECB, reducing the number of design errors, and finding rational technical solutions. Simulation provides a search for options for uniform load distribution on the elements and joints of products, reduction of bending, torsional, temperature, and assembly deformations, balancing the inertial loads, and increasing the strength and endurance of materials and joints. [ABSTRACT FROM AUTHOR]
Copyright of Russian Microelectronics is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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  Data: Development and Research on Multichip Microsystems Based on Modular Three-Dimensional Integration of Chips.
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  Data: <searchLink fieldCode="JN" term="%22Russian+Microelectronics%22">Russian Microelectronics</searchLink>. Dec2025, Vol. 54 Issue 7, p781-786. 6p.
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  Data: <searchLink fieldCode="DE" term="%22Multichip+modules+%28Microelectronics%29%22">Multichip modules (Microelectronics)</searchLink><br /><searchLink fieldCode="DE" term="%22Finite+element+method%22">Finite element method</searchLink><br /><searchLink fieldCode="DE" term="%22Modular+design%22">Modular design</searchLink><br /><searchLink fieldCode="DE" term="%22Mechanical+behavior+of+materials%22">Mechanical behavior of materials</searchLink><br /><searchLink fieldCode="DE" term="%22Durability%22">Durability</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+resistance%22">Thermal resistance</searchLink>
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  Data: The approach to create a highly-integrated electronic component base (ECB) based on three-dimensional (3D) multichip microsystems (MCMs) is progressing intensely and is being implemented in areas such as multilevel packaging of packaged microchips, unpackaged microchips, and semiconductor structures. This approach involves stacking a set of chips in 3D multichip modules and has a variety of advantages compared to 2D-constructions due to the greater functional density and efficiency of chip placement and assembly. In this paper, studies of MCMs on exposure to various influencing factors are carried out. The significant impact of the materials' physical and mechanical properties, as well as structural-and-technological solutions, on product strength is shown. It is established that ensuring the reliability of the electronic component base under formation, targeted at reducing the number of failures and damage, as well as increasing resistance to mechanical, temperature, and other actions, is assured by observing the set of developed scientific and technical recommendations. A criterion of evaluating the durability of conductors, taking into account the linear hardening of the material and plastic strain in the loading cycle, is developed. A comprehensive engineering calculation with simulation based on the finite-element method allows considering the totality of the structural, technological, and operational aspects of the development of the ECB, reducing the number of design errors, and finding rational technical solutions. Simulation provides a search for options for uniform load distribution on the elements and joints of products, reduction of bending, torsional, temperature, and assembly deformations, balancing the inertial loads, and increasing the strength and endurance of materials and joints. [ABSTRACT FROM AUTHOR]
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  Data: <i>Copyright of Russian Microelectronics is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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              Text: Dec2025
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