Hybrid Interfaces of 2D Materials with Polymers for Emerging Electronics and Energy Devices.

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Title: Hybrid Interfaces of 2D Materials with Polymers for Emerging Electronics and Energy Devices.
Authors: Go, Jaehyuk1 (AUTHOR), Kim, Jaehyun1 (AUTHOR), Ju, Sanghyeok1 (AUTHOR), Yang, Daekyoung1 (AUTHOR), Kang, Seongchan1 (AUTHOR), Park, Heekyeong1 (AUTHOR) parkpa01@kyonggi.ac.kr
Source: Materials (1996-1944). Feb2026, Vol. 19 Issue 3, p602. 34p.
Subjects: Two-dimensional materials (Nanotechnology), Polymers, Energy conservation equipment, Fabrication (Manufacturing), Electronic equipment, Optoelectronics, Charge transfer
Abstract: Two-dimensional (2D) materials offer exceptional electrical, optical, and mechanical properties but face challenges in terms of scalability, stability, and integration. Hybridizing 2D materials with polymers provides an effective route to overcome these limitations by enabling tunable interfaces, mechanical compliance, chemical functionality, and three-dimensional device processability. This review summarizes the fundamental structural configurations of 2D–polymer hybrids, including embedded composites, stacked heterostructures, covalently functionalized interfaces, polymer-encapsulated layers, and fiber–network architecture, and describes how their interfacial interactions dictate charge transport, environmental robustness, and mechanical behavior. We also highlight major fabrication strategies, such as solution dispersion, in situ polymerization, and vapor-phase deposition. Finally, we discuss emerging applications in sensors, optoelectronics, neuromorphic systems, and energy devices, demonstrating how synergistic coupling between 2D materials and functional polymers enables enhanced sensitivity, programmable electronic states, broadband photodetection, and improved electrochemical performance. These insights provide design guidelines for future multifunctional and scalable 2D–polymer hybrid platforms. [ABSTRACT FROM AUTHOR]
Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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  Data: Hybrid Interfaces of 2D Materials with Polymers for Emerging Electronics and Energy Devices.
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  Data: <searchLink fieldCode="JN" term="%22Materials+%281996-1944%29%22">Materials (1996-1944)</searchLink>. Feb2026, Vol. 19 Issue 3, p602. 34p.
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  Data: <searchLink fieldCode="DE" term="%22Two-dimensional+materials+%28Nanotechnology%29%22">Two-dimensional materials (Nanotechnology)</searchLink><br /><searchLink fieldCode="DE" term="%22Polymers%22">Polymers</searchLink><br /><searchLink fieldCode="DE" term="%22Energy+conservation+equipment%22">Energy conservation equipment</searchLink><br /><searchLink fieldCode="DE" term="%22Fabrication+%28Manufacturing%29%22">Fabrication (Manufacturing)</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+equipment%22">Electronic equipment</searchLink><br /><searchLink fieldCode="DE" term="%22Optoelectronics%22">Optoelectronics</searchLink><br /><searchLink fieldCode="DE" term="%22Charge+transfer%22">Charge transfer</searchLink>
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  Data: Two-dimensional (2D) materials offer exceptional electrical, optical, and mechanical properties but face challenges in terms of scalability, stability, and integration. Hybridizing 2D materials with polymers provides an effective route to overcome these limitations by enabling tunable interfaces, mechanical compliance, chemical functionality, and three-dimensional device processability. This review summarizes the fundamental structural configurations of 2D–polymer hybrids, including embedded composites, stacked heterostructures, covalently functionalized interfaces, polymer-encapsulated layers, and fiber–network architecture, and describes how their interfacial interactions dictate charge transport, environmental robustness, and mechanical behavior. We also highlight major fabrication strategies, such as solution dispersion, in situ polymerization, and vapor-phase deposition. Finally, we discuss emerging applications in sensors, optoelectronics, neuromorphic systems, and energy devices, demonstrating how synergistic coupling between 2D materials and functional polymers enables enhanced sensitivity, programmable electronic states, broadband photodetection, and improved electrochemical performance. These insights provide design guidelines for future multifunctional and scalable 2D–polymer hybrid platforms. [ABSTRACT FROM AUTHOR]
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  Label:
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  Data: <i>Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.3390/ma19030602
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        Text: English
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        PageCount: 34
        StartPage: 602
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      – SubjectFull: Two-dimensional materials (Nanotechnology)
        Type: general
      – SubjectFull: Polymers
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      – SubjectFull: Energy conservation equipment
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      – SubjectFull: Fabrication (Manufacturing)
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      – SubjectFull: Electronic equipment
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      – SubjectFull: Optoelectronics
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      – SubjectFull: Charge transfer
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      – TitleFull: Hybrid Interfaces of 2D Materials with Polymers for Emerging Electronics and Energy Devices.
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            NameFull: Go, Jaehyuk
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            NameFull: Yang, Daekyoung
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            NameFull: Kang, Seongchan
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              Text: Feb2026
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              Y: 2026
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              Value: 19
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