Thermally cycling-stable and highly heat-dissipative BGA packages manufactured by fluxless laser soldering: Experimental and numerical investigations.
Saved in:
| Title: | Thermally cycling-stable and highly heat-dissipative BGA packages manufactured by fluxless laser soldering: Experimental and numerical investigations. |
|---|---|
| Authors: | Kim, Dongjin1 (AUTHOR) dongjinkim@kitech.re.kr, Han, Seonghui1 (AUTHOR), Baik, Junha1 (AUTHOR), Park, Junwoo1 (AUTHOR), Yu, Ha-Young2 (AUTHOR), Chung, Kwansik3 (AUTHOR), Kim, Eunchae3 (AUTHOR), Yoo, Sehoon1 (AUTHOR) yoos@kitech.re.kr |
| Source: | Microelectronics Reliability. Mar2026, Vol. 178, pN.PAG-N.PAG. 1p. |
| Subjects: | Solder & soldering, Ball grid array technology, Metal compounds, Energy dissipation, Thermocycling, Thermal shock |
| Abstract: | This study developed the flux-less solder ball (i.e., Sn-3wt%Ag-0.5wt%Cu) attachment technology (FLAT), a novel and eco-friendly approach that eliminates flux processing during mass reflow while significantly reducing the warpages. Furthermore, the ball grid array (BGA) package applied with FLAT was directly compared with the BGA package manufactured by the conventional mass reflow manufacturing method in terms of thermal cycling reliability. As a result, FLAT made an intermetallic compound (IMC) of less than 1.6 μm at bonding interfaces by an instantaneous laser heat source, and solidified immediately after nucleation, forming a solder ball composed of uniform and fine beta-Sn. In contrast, the conventional mass reflow soldering using flux has caused the formation of massive Cu 6 Sn 5 chunks inside the BGA package, and even the thickness of the IMC at the bonding interface with the pad exceeded 4.8 μm. The interfacial IMC layer suppressed by FLAT suppressed the spalling phenomenon during the continuous thermal cycling tests. In contrast, the interfacial IMC layer formed by the conventional mass reflow process had a relatively long aspect ratio, which promoted interdiffusion with the Sn matrix during thermal cycling, allowing the spalling of a large amount of Cu 6 Sn 5 chunks into the Sn matrix. This distinguished behavior explains the distinct pros and cons of the two processes in thermal shock resistance, which determines the rigidity and heat dissipation properties within the solder. This study systematically addresses the thermal cycling behaviors of BGA packages manufactured by FLAT and MR, and heat transfer performances originated from this IMC growth behavior through numerical calculation. • Low-energy process without cleaning through fluxless laser soldering • Exceptional IMC control through low-energy process • IMC thickness control to improve micro-heat transfer performance [ABSTRACT FROM AUTHOR] |
| Copyright of Microelectronics Reliability is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
|---|---|
| Header | DbId: egs DbLabel: Engineering Source An: 191635776 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
| IllustrationInfo | |
| Items | – Name: Title Label: Title Group: Ti Data: Thermally cycling-stable and highly heat-dissipative BGA packages manufactured by fluxless laser soldering: Experimental and numerical investigations. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Kim%2C+Dongjin%22">Kim, Dongjin</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> dongjinkim@kitech.re.kr</i><br /><searchLink fieldCode="AR" term="%22Han%2C+Seonghui%22">Han, Seonghui</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Baik%2C+Junha%22">Baik, Junha</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Park%2C+Junwoo%22">Park, Junwoo</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Yu%2C+Ha-Young%22">Yu, Ha-Young</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Chung%2C+Kwansik%22">Chung, Kwansik</searchLink><relatesTo>3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Kim%2C+Eunchae%22">Kim, Eunchae</searchLink><relatesTo>3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Yoo%2C+Sehoon%22">Yoo, Sehoon</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> yoos@kitech.re.kr</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Microelectronics+Reliability%22">Microelectronics Reliability</searchLink>. Mar2026, Vol. 178, pN.PAG-N.PAG. 1p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Solder+%26+soldering%22">Solder & soldering</searchLink><br /><searchLink fieldCode="DE" term="%22Ball+grid+array+technology%22">Ball grid array technology</searchLink><br /><searchLink fieldCode="DE" term="%22Metal+compounds%22">Metal compounds</searchLink><br /><searchLink fieldCode="DE" term="%22Energy+dissipation%22">Energy dissipation</searchLink><br /><searchLink fieldCode="DE" term="%22Thermocycling%22">Thermocycling</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+shock%22">Thermal shock</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: This study developed the flux-less solder ball (i.e., Sn-3wt%Ag-0.5wt%Cu) attachment technology (FLAT), a novel and eco-friendly approach that eliminates flux processing during mass reflow while significantly reducing the warpages. Furthermore, the ball grid array (BGA) package applied with FLAT was directly compared with the BGA package manufactured by the conventional mass reflow manufacturing method in terms of thermal cycling reliability. As a result, FLAT made an intermetallic compound (IMC) of less than 1.6 μm at bonding interfaces by an instantaneous laser heat source, and solidified immediately after nucleation, forming a solder ball composed of uniform and fine beta-Sn. In contrast, the conventional mass reflow soldering using flux has caused the formation of massive Cu 6 Sn 5 chunks inside the BGA package, and even the thickness of the IMC at the bonding interface with the pad exceeded 4.8 μm. The interfacial IMC layer suppressed by FLAT suppressed the spalling phenomenon during the continuous thermal cycling tests. In contrast, the interfacial IMC layer formed by the conventional mass reflow process had a relatively long aspect ratio, which promoted interdiffusion with the Sn matrix during thermal cycling, allowing the spalling of a large amount of Cu 6 Sn 5 chunks into the Sn matrix. This distinguished behavior explains the distinct pros and cons of the two processes in thermal shock resistance, which determines the rigidity and heat dissipation properties within the solder. This study systematically addresses the thermal cycling behaviors of BGA packages manufactured by FLAT and MR, and heat transfer performances originated from this IMC growth behavior through numerical calculation. • Low-energy process without cleaning through fluxless laser soldering • Exceptional IMC control through low-energy process • IMC thickness control to improve micro-heat transfer performance [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Microelectronics Reliability is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=191635776 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1016/j.microrel.2026.116018 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 1 StartPage: N.PAG Subjects: – SubjectFull: Solder & soldering Type: general – SubjectFull: Ball grid array technology Type: general – SubjectFull: Metal compounds Type: general – SubjectFull: Energy dissipation Type: general – SubjectFull: Thermocycling Type: general – SubjectFull: Thermal shock Type: general Titles: – TitleFull: Thermally cycling-stable and highly heat-dissipative BGA packages manufactured by fluxless laser soldering: Experimental and numerical investigations. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Kim, Dongjin – PersonEntity: Name: NameFull: Han, Seonghui – PersonEntity: Name: NameFull: Baik, Junha – PersonEntity: Name: NameFull: Park, Junwoo – PersonEntity: Name: NameFull: Yu, Ha-Young – PersonEntity: Name: NameFull: Chung, Kwansik – PersonEntity: Name: NameFull: Kim, Eunchae – PersonEntity: Name: NameFull: Yoo, Sehoon IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 03 Text: Mar2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 00262714 Numbering: – Type: volume Value: 178 Titles: – TitleFull: Microelectronics Reliability Type: main |
| ResultId | 1 |
