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Polyimide films featuring surface micron-scale pores for superior multipactor inhibition.

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Title: Polyimide films featuring surface micron-scale pores for superior multipactor inhibition.
Authors: Li, Wen-Rui1 (AUTHOR), Liu, Hao-Yan1 (AUTHOR), Sun, Guang-Yu1,2 (AUTHOR) guangyu.sun@foxmail.com, Zhang, Yu-Cheng1 (AUTHOR), Qi, Chang-Chun1 (AUTHOR), Qin, Xiao-Gang3 (AUTHOR), Song, Bai-Peng1 (AUTHOR), Zhang, Guan-Jun1 (AUTHOR) gjzhang@xjtu.edu.cn
Source: Vacuum. Apr2026, Vol. 247, pN.PAG-N.PAG. 1p.
Subjects: Porosity, Secondary electron emission, Computer simulation, Surface discharges (Electricity), Polyimide films
Abstract: In vacuum-dielectric insulation systems, the interface where dielectric is in contact with vacuum is a weak point of insulation, and the frequent occurrence of surface flashover poses a threat to the safe operation of the system. This study proposes a novel approach to mitigate flashover by constructing micron-scale pores on polyimide (PI) surfaces, fabricating films with surface pore diameters of 3.8 ± 0.9 μm, 6.0 ± 1.3 μm, 9.8 ± 2.8 μm, and 11.0 ± 3.6 μm. Experimental results demonstrate PI films with surface micron pores exhibit significantly improved flashover thresholds and a notable reduction in secondary electron yield (SEY). When the pore diameter is 11.0 ± 3.6 μm, the DC and impulse flashover thresholds increase by up to ∼79% and ∼187%, respectively, while the maximum SEY (δ max) decreases to 1.32. Particle-in-cell (PIC) simulations further validate the inhibitory effect on multipactor. It is observed that electrons are guided into pores during movement and ultimately trapped, significantly slowing down the electron avalanche development, reducing the rate of increase in average surface charge density. The electric field configuration within the pores and pore geometry facilitates the capture of electrons. This study provides an in-depth understanding of the mechanism by which surface micron-scale pores suppress multipactor and alleviate flashover, offering valuable guidance for addressing flashover problems. [ABSTRACT FROM AUTHOR]
Copyright of Vacuum is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 191662181
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Polyimide films featuring surface micron-scale pores for superior multipactor inhibition.
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  Data: <searchLink fieldCode="AR" term="%22Li%2C+Wen-Rui%22">Li, Wen-Rui</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Liu%2C+Hao-Yan%22">Liu, Hao-Yan</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Sun%2C+Guang-Yu%22">Sun, Guang-Yu</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<i> guangyu.sun@foxmail.com</i><br /><searchLink fieldCode="AR" term="%22Zhang%2C+Yu-Cheng%22">Zhang, Yu-Cheng</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Qi%2C+Chang-Chun%22">Qi, Chang-Chun</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Qin%2C+Xiao-Gang%22">Qin, Xiao-Gang</searchLink><relatesTo>3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Song%2C+Bai-Peng%22">Song, Bai-Peng</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhang%2C+Guan-Jun%22">Zhang, Guan-Jun</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> gjzhang@xjtu.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Vacuum%22">Vacuum</searchLink>. Apr2026, Vol. 247, pN.PAG-N.PAG. 1p.
– Name: Subject
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  Data: <searchLink fieldCode="DE" term="%22Porosity%22">Porosity</searchLink><br /><searchLink fieldCode="DE" term="%22Secondary+electron+emission%22">Secondary electron emission</searchLink><br /><searchLink fieldCode="DE" term="%22Computer+simulation%22">Computer simulation</searchLink><br /><searchLink fieldCode="DE" term="%22Surface+discharges+%28Electricity%29%22">Surface discharges (Electricity)</searchLink><br /><searchLink fieldCode="DE" term="%22Polyimide+films%22">Polyimide films</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: In vacuum-dielectric insulation systems, the interface where dielectric is in contact with vacuum is a weak point of insulation, and the frequent occurrence of surface flashover poses a threat to the safe operation of the system. This study proposes a novel approach to mitigate flashover by constructing micron-scale pores on polyimide (PI) surfaces, fabricating films with surface pore diameters of 3.8 ± 0.9 μm, 6.0 ± 1.3 μm, 9.8 ± 2.8 μm, and 11.0 ± 3.6 μm. Experimental results demonstrate PI films with surface micron pores exhibit significantly improved flashover thresholds and a notable reduction in secondary electron yield (SEY). When the pore diameter is 11.0 ± 3.6 μm, the DC and impulse flashover thresholds increase by up to ∼79% and ∼187%, respectively, while the maximum SEY (δ max) decreases to 1.32. Particle-in-cell (PIC) simulations further validate the inhibitory effect on multipactor. It is observed that electrons are guided into pores during movement and ultimately trapped, significantly slowing down the electron avalanche development, reducing the rate of increase in average surface charge density. The electric field configuration within the pores and pore geometry facilitates the capture of electrons. This study provides an in-depth understanding of the mechanism by which surface micron-scale pores suppress multipactor and alleviate flashover, offering valuable guidance for addressing flashover problems. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Vacuum is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1016/j.vacuum.2026.115168
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 1
        StartPage: N.PAG
    Subjects:
      – SubjectFull: Porosity
        Type: general
      – SubjectFull: Secondary electron emission
        Type: general
      – SubjectFull: Computer simulation
        Type: general
      – SubjectFull: Surface discharges (Electricity)
        Type: general
      – SubjectFull: Polyimide films
        Type: general
    Titles:
      – TitleFull: Polyimide films featuring surface micron-scale pores for superior multipactor inhibition.
        Type: main
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      – PersonEntity:
          Name:
            NameFull: Li, Wen-Rui
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            NameFull: Liu, Hao-Yan
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            NameFull: Sun, Guang-Yu
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            NameFull: Zhang, Yu-Cheng
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            NameFull: Qi, Chang-Chun
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            NameFull: Qin, Xiao-Gang
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            NameFull: Song, Bai-Peng
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            NameFull: Zhang, Guan-Jun
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          Dates:
            – D: 01
              M: 04
              Text: Apr2026
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 0042207X
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              Value: 247
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            – TitleFull: Vacuum
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