UV-curable, Transparent, and Low Volume-shrinkage Silicones for Efficient Mini-LED Encapsulation.
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| Title: | UV-curable, Transparent, and Low Volume-shrinkage Silicones for Efficient Mini-LED Encapsulation. |
|---|---|
| Authors: | Zhang, Zi-Hua1 (AUTHOR), Ye, Juan1 (AUTHOR), Wen, Wei-Shan1 (AUTHOR), Luo, Qing-Hong2 (AUTHOR), Xiang, Hong-Ping1 (AUTHOR) xianghongping@gdut.edu.cn |
| Source: | Chinese Journal of Polymer Science (Springer Science & Business Media B.V.). Feb2026, Vol. 44 Issue 2, p599-610. 12p. |
| Subjects: | Microelectronic packaging, Photopolymerization, Thermal stability, Transparency (Optics), Disulfides |
| Abstract: | Mini light-emitting diodes (Mini-LEDs) show great application potential in high-end displays owing to their superior pixel density, brightness, responsiveness, and efficiency. However, current packaging materials for Mini-LEDs are predominantly thermally cured, which is energy- and time-consuming and can adversely affect electronic components. In this study, a novel UV-curable silicone resin containing phenyl, disulfide, and acryloyl groups (SPASR) is developed from commercially available siloxanes. The resin exhibits a refractive index (nd) higher than 1.5, and it can be cured within 30 s under UV irradiation. After curing, it exhibits an optical transparency exceeding 92%, a lap adhesion strength of up to 1.84 MPa, and good thermostability (T5%>265 °C). Notably, the volume shrinkage is less than 4.83%, attributed to the release of photopolymerization stress via UV-induced disulfide metathesis during UV curing. Mini-LEDs encapsulated with this resin show luminescence properties comparable to those of conventional thermally-cured sealants, and show excellent sealability wihtout visible penetration after being immersed in red ink for 12 h. Consequently, these excellent properties make the SPASR resin an ideal candidate for microelectronic encapsulation, offering a more reliable and efficient solution for the electronics industry. [ABSTRACT FROM AUTHOR] |
| Copyright of Chinese Journal of Polymer Science (Springer Science & Business Media B.V.) is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 191810079 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: UV-curable, Transparent, and Low Volume-shrinkage Silicones for Efficient Mini-LED Encapsulation. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Zhang%2C+Zi-Hua%22">Zhang, Zi-Hua</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Ye%2C+Juan%22">Ye, Juan</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Wen%2C+Wei-Shan%22">Wen, Wei-Shan</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Luo%2C+Qing-Hong%22">Luo, Qing-Hong</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Xiang%2C+Hong-Ping%22">Xiang, Hong-Ping</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> xianghongping@gdut.edu.cn</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Chinese+Journal+of+Polymer+Science+%28Springer+Science+%26+Business+Media+B%2EV%2E%29%22">Chinese Journal of Polymer Science (Springer Science & Business Media B.V.)</searchLink>. Feb2026, Vol. 44 Issue 2, p599-610. 12p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Microelectronic+packaging%22">Microelectronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Photopolymerization%22">Photopolymerization</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+stability%22">Thermal stability</searchLink><br /><searchLink fieldCode="DE" term="%22Transparency+%28Optics%29%22">Transparency (Optics)</searchLink><br /><searchLink fieldCode="DE" term="%22Disulfides%22">Disulfides</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Mini light-emitting diodes (Mini-LEDs) show great application potential in high-end displays owing to their superior pixel density, brightness, responsiveness, and efficiency. However, current packaging materials for Mini-LEDs are predominantly thermally cured, which is energy- and time-consuming and can adversely affect electronic components. In this study, a novel UV-curable silicone resin containing phenyl, disulfide, and acryloyl groups (SPASR) is developed from commercially available siloxanes. The resin exhibits a refractive index (nd) higher than 1.5, and it can be cured within 30 s under UV irradiation. After curing, it exhibits an optical transparency exceeding 92%, a lap adhesion strength of up to 1.84 MPa, and good thermostability (T5%>265 °C). Notably, the volume shrinkage is less than 4.83%, attributed to the release of photopolymerization stress via UV-induced disulfide metathesis during UV curing. Mini-LEDs encapsulated with this resin show luminescence properties comparable to those of conventional thermally-cured sealants, and show excellent sealability wihtout visible penetration after being immersed in red ink for 12 h. Consequently, these excellent properties make the SPASR resin an ideal candidate for microelectronic encapsulation, offering a more reliable and efficient solution for the electronics industry. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Chinese Journal of Polymer Science (Springer Science & Business Media B.V.) is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s10118-025-3506-4 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 12 StartPage: 599 Subjects: – SubjectFull: Microelectronic packaging Type: general – SubjectFull: Photopolymerization Type: general – SubjectFull: Thermal stability Type: general – SubjectFull: Transparency (Optics) Type: general – SubjectFull: Disulfides Type: general Titles: – TitleFull: UV-curable, Transparent, and Low Volume-shrinkage Silicones for Efficient Mini-LED Encapsulation. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Zhang, Zi-Hua – PersonEntity: Name: NameFull: Ye, Juan – PersonEntity: Name: NameFull: Wen, Wei-Shan – PersonEntity: Name: NameFull: Luo, Qing-Hong – PersonEntity: Name: NameFull: Xiang, Hong-Ping IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 02 Text: Feb2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 02567679 Numbering: – Type: volume Value: 44 – Type: issue Value: 2 Titles: – TitleFull: Chinese Journal of Polymer Science (Springer Science & Business Media B.V.) Type: main |
| ResultId | 1 |
