Cost-Effective High-Performance Flip Chip MicroLeadFrame® (fcMLF®) Package Introduction.
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| Title: | Cost-Effective High-Performance Flip Chip MicroLeadFrame® (fcMLF®) Package Introduction. |
|---|---|
| Authors: | Hoefer, Luke1, Kim, KyungSu1 |
| Source: | Advancing Microelectronics. 2026, Vol. 53 Issue 1, p14-18. 5p. |
| Subjects: | Flip chip technology, Microelectronic packaging, Automotive engineering, Thermal properties, Printed circuits, Packaging industry, Power supply quality |
| Abstract: | The demand for cost-effective leadframe packages continues to grow, particularly for automotive and commercial applications. These designs require smaller form factors, enhanced thermal and electrical performance, and proven reliability. Flip chip on leadframe technology offers significant advantages over traditional wirebonded MicroLeadFrame® (MLF®) and high-cost laminate Flip Chip Chip Scale Package (fcCSP) designs, including enhanced thermal and electrical characteristics and reduced package size compared to traditional wirebond solutions such as MLF®. As industry pushes for cost effective solutions targeting thinner and more compact profiles than available in wirebond solutions, flip chip technology enables die size reduction and printed circuit board (PCB) area savings compared to conventional wire-bonded MLF® packages. The use of copper (Cu) pillar bumps supports fine-pitch designs and offers flexibility for fan-in leadframe configurations. The flip chip MicroLeadFrame (fcMLF®) package presents a compelling solution for a wide range of applications, including power management integrated circuits (PMICs), DC/DC converters, and RF switches. As with a traditional MLF® package, Amkor's wettable flank feature, both dimple and step-cut configurations can be supported. A requirement of the automotive industry, the wettable flank enhancement enables Automated Optical Inspection (AOI) for proper fillet formation during the Printed Circuit Board (PCB) solder reflow process without requiring an expensive and complex through board X-Rays process. By leveraging industry-leading flip chip interconnect technology and an established sawn MLF® manufacturing process, fcMLF® packaging delivers a cost-effective, high-performance leadframe packaging solution tailored to meet the evolving needs of modern electronic systems. [ABSTRACT FROM AUTHOR] |
| Copyright of Advancing Microelectronics is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
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| Header | DbId: egs DbLabel: Engineering Source An: 192075997 AccessLevel: 6 PubType: Periodical PubTypeId: serialPeriodical PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Cost-Effective High-Performance Flip Chip MicroLeadFrame® (fcMLF®) Package Introduction. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Hoefer%2C+Luke%22">Hoefer, Luke</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Kim%2C+KyungSu%22">Kim, KyungSu</searchLink><relatesTo>1</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Advancing+Microelectronics%22">Advancing Microelectronics</searchLink>. 2026, Vol. 53 Issue 1, p14-18. 5p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Flip+chip+technology%22">Flip chip technology</searchLink><br /><searchLink fieldCode="DE" term="%22Microelectronic+packaging%22">Microelectronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Automotive+engineering%22">Automotive engineering</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+properties%22">Thermal properties</searchLink><br /><searchLink fieldCode="DE" term="%22Printed+circuits%22">Printed circuits</searchLink><br /><searchLink fieldCode="DE" term="%22Packaging+industry%22">Packaging industry</searchLink><br /><searchLink fieldCode="DE" term="%22Power+supply+quality%22">Power supply quality</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: The demand for cost-effective leadframe packages continues to grow, particularly for automotive and commercial applications. These designs require smaller form factors, enhanced thermal and electrical performance, and proven reliability. Flip chip on leadframe technology offers significant advantages over traditional wirebonded MicroLeadFrame® (MLF®) and high-cost laminate Flip Chip Chip Scale Package (fcCSP) designs, including enhanced thermal and electrical characteristics and reduced package size compared to traditional wirebond solutions such as MLF®. As industry pushes for cost effective solutions targeting thinner and more compact profiles than available in wirebond solutions, flip chip technology enables die size reduction and printed circuit board (PCB) area savings compared to conventional wire-bonded MLF® packages. The use of copper (Cu) pillar bumps supports fine-pitch designs and offers flexibility for fan-in leadframe configurations. The flip chip MicroLeadFrame (fcMLF®) package presents a compelling solution for a wide range of applications, including power management integrated circuits (PMICs), DC/DC converters, and RF switches. As with a traditional MLF® package, Amkor's wettable flank feature, both dimple and step-cut configurations can be supported. A requirement of the automotive industry, the wettable flank enhancement enables Automated Optical Inspection (AOI) for proper fillet formation during the Printed Circuit Board (PCB) solder reflow process without requiring an expensive and complex through board X-Rays process. By leveraging industry-leading flip chip interconnect technology and an established sawn MLF® manufacturing process, fcMLF® packaging delivers a cost-effective, high-performance leadframe packaging solution tailored to meet the evolving needs of modern electronic systems. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Advancing Microelectronics is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 5 StartPage: 14 Subjects: – SubjectFull: Flip chip technology Type: general – SubjectFull: Microelectronic packaging Type: general – SubjectFull: Automotive engineering Type: general – SubjectFull: Thermal properties Type: general – SubjectFull: Printed circuits Type: general – SubjectFull: Packaging industry Type: general – SubjectFull: Power supply quality Type: general Titles: – TitleFull: Cost-Effective High-Performance Flip Chip MicroLeadFrame® (fcMLF®) Package Introduction. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Hoefer, Luke – PersonEntity: Name: NameFull: Kim, KyungSu IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 01 Text: 2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 23807008 Numbering: – Type: volume Value: 53 – Type: issue Value: 1 Titles: – TitleFull: Advancing Microelectronics Type: main |
| ResultId | 1 |
