APA (7th ed.) Citation

Ke, G., Feng, J., Ma, M., Li, Y., & Liu, Z. (2026). Boosting screen-printing and microwave electrical performance of copper paste for LTCC applications through rheological control. Journal of Materials Science: Materials in Electronics, 37(9), 1. https://doi.org/10.1007/s10854-026-16990-x

Chicago Style (17th ed.) Citation

Ke, Gengrun, Jingjing Feng, Mingsheng Ma, Yongxiang Li, and Zhifu Liu. "Boosting Screen-printing and Microwave Electrical Performance of Copper Paste for LTCC Applications Through Rheological Control." Journal of Materials Science: Materials in Electronics 37, no. 9 (2026): 1. https://doi.org/10.1007/s10854-026-16990-x.

MLA (9th ed.) Citation

Ke, Gengrun, et al. "Boosting Screen-printing and Microwave Electrical Performance of Copper Paste for LTCC Applications Through Rheological Control." Journal of Materials Science: Materials in Electronics, vol. 37, no. 9, 2026, p. 1, https://doi.org/10.1007/s10854-026-16990-x.