Thermal Stability and Barrier Properties of Polyamide 6 Reinforced by Carbazole Based Copolymerization.

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Title: Thermal Stability and Barrier Properties of Polyamide 6 Reinforced by Carbazole Based Copolymerization.
Authors: Yi, Yong1,2 (AUTHOR), Li, Jianlin1,2,3 (AUTHOR) lijianlin@stu.hut.edu.cn, Wang, Wenzhi1,2,3 (AUTHOR) wangwenzhi@hut.edu.cn, Wang, Chunhua1,2 (AUTHOR), Liu, Yuejun1,2 (AUTHOR)
Source: Polymers (20734360). Mar2026, Vol. 18 Issue 5, p559. 14p.
Subjects: Thermal stability, Copolymerization, Polyamides, Sorption, Thermal resistance, Mechanical behavior of materials, Permeability
Abstract: Polyamide 6 (PA6) is limited in its application in precision and high-temperature fields due to its high moisture absorption, low heat resistance, and poor barrier properties. To overcome these intrinsic deficiencies, a rigid 9-(carboxyphenyl)carbazole-based diacid monomer (CzIPA) was incorporated into the PA6 backbone via one-step melt polycondensation. Structural analyses confirmed successful copolymer formation and effective modulation of hydrogen-bonding interactions and chain rigidity. The introduction of the bulky carbazole units markedly enhanced the thermal and physical properties of PA6. The glass transition temperature increased by up to 35.5 °C, while the maximum decomposition temperature rose by 23.8 °C, reflecting the reduced chain mobility and strengthened thermal resistance. The decreased amide-group density led to a 15% reduction in water absorption, improving dimensional stability. The Young's modulus, flexural strength, and flexural modulus of the prepared copolymers were significantly improved compared to PA6, while the toughness was slightly reduced. Furthermore, oxygen and water-vapor permeabilities were simultaneously reduced by 30–35%, attributed to restricted diffusion pathways in the modified microstructure. Despite the increased rigidity, the copolymers maintained good melt processability with clear shear-thinning behavior. This study demonstrates CzIPA copolymerization as an efficient structural design strategy for producing high-performance PA6 materials with enhanced thermal stability, lower hygroscopicity, and superior barrier properties. [ABSTRACT FROM AUTHOR]
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  Label: Title
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  Data: Thermal Stability and Barrier Properties of Polyamide 6 Reinforced by Carbazole Based Copolymerization.
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  Data: <searchLink fieldCode="JN" term="%22Polymers+%2820734360%29%22">Polymers (20734360)</searchLink>. Mar2026, Vol. 18 Issue 5, p559. 14p.
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  Data: <searchLink fieldCode="DE" term="%22Thermal+stability%22">Thermal stability</searchLink><br /><searchLink fieldCode="DE" term="%22Copolymerization%22">Copolymerization</searchLink><br /><searchLink fieldCode="DE" term="%22Polyamides%22">Polyamides</searchLink><br /><searchLink fieldCode="DE" term="%22Sorption%22">Sorption</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+resistance%22">Thermal resistance</searchLink><br /><searchLink fieldCode="DE" term="%22Mechanical+behavior+of+materials%22">Mechanical behavior of materials</searchLink><br /><searchLink fieldCode="DE" term="%22Permeability%22">Permeability</searchLink>
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  Label: Abstract
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  Data: Polyamide 6 (PA6) is limited in its application in precision and high-temperature fields due to its high moisture absorption, low heat resistance, and poor barrier properties. To overcome these intrinsic deficiencies, a rigid 9-(carboxyphenyl)carbazole-based diacid monomer (CzIPA) was incorporated into the PA6 backbone via one-step melt polycondensation. Structural analyses confirmed successful copolymer formation and effective modulation of hydrogen-bonding interactions and chain rigidity. The introduction of the bulky carbazole units markedly enhanced the thermal and physical properties of PA6. The glass transition temperature increased by up to 35.5 °C, while the maximum decomposition temperature rose by 23.8 °C, reflecting the reduced chain mobility and strengthened thermal resistance. The decreased amide-group density led to a 15% reduction in water absorption, improving dimensional stability. The Young's modulus, flexural strength, and flexural modulus of the prepared copolymers were significantly improved compared to PA6, while the toughness was slightly reduced. Furthermore, oxygen and water-vapor permeabilities were simultaneously reduced by 30–35%, attributed to restricted diffusion pathways in the modified microstructure. Despite the increased rigidity, the copolymers maintained good melt processability with clear shear-thinning behavior. This study demonstrates CzIPA copolymerization as an efficient structural design strategy for producing high-performance PA6 materials with enhanced thermal stability, lower hygroscopicity, and superior barrier properties. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Polymers (20734360) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.3390/polym18050559
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      – Code: eng
        Text: English
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        PageCount: 14
        StartPage: 559
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      – SubjectFull: Thermal stability
        Type: general
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      – SubjectFull: Polyamides
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      – SubjectFull: Sorption
        Type: general
      – SubjectFull: Thermal resistance
        Type: general
      – SubjectFull: Mechanical behavior of materials
        Type: general
      – SubjectFull: Permeability
        Type: general
    Titles:
      – TitleFull: Thermal Stability and Barrier Properties of Polyamide 6 Reinforced by Carbazole Based Copolymerization.
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            NameFull: Yi, Yong
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            NameFull: Li, Jianlin
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            NameFull: Wang, Wenzhi
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            NameFull: Wang, Chunhua
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            NameFull: Liu, Yuejun
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            – D: 01
              M: 03
              Text: Mar2026
              Type: published
              Y: 2026
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