Enhancing Cu-Cu Stitch Bonding Reliability on Cu Leadframe Through Ultrathin Cu-Selective Passivation.
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| Title: | Enhancing Cu-Cu Stitch Bonding Reliability on Cu Leadframe Through Ultrathin Cu-Selective Passivation. |
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| Authors: | Nair, Shyam Muralidharan1, Perera, Duwage Anushka Sandaruwan1, Farmer, Gavin2, Abraham, James2, Tran, Khanh Tuyet Anh1, Philipose, Usha2, Chyan, Oliver1 |
| Source: | Journal of Microelectronic & Electronic Packaging. 2026, Vol. 23 Issue 1, p9-17. 9p. |
| Subjects: | Wire bonding (Electronic packaging), Microelectronic packaging, Packaging industry, Corrosion prevention |
| Abstract: | Despite advances in 2.5D and 3D packaging, ultrasonic wedge (stitch) bonding remains the industry standard due to its cost-effectiveness. However, the transition to copper (Cu) and palladium-coated copper (PCC) wire introduces reliability challenges, traditionally mitigated by expensive and environmentally concerning silver (Ag) plating on leadframes (LF). To address this, we developed a low-cost, ultrathin Cu-selective passivation coating that suppresses oxidation, enabling direct Cu-Cu bonding without Ag. This process-compatible coating was evaluated on Cu-LFs using 25 µm Al-1 wt% Si and PCC wires under varying thermal conditions (125 ℃-200 ℃). Optimization of bonding force, time, and ultrasonic power yielded substantial improvements in pull strength. Notably, while bare-Cu bonds failed at the oxidized interface, passivated samples failed at the wire neck, confirming superior bond integrity. This work highlights a promising, environmentally sustainable alternative to Ag plating, enabling reliable Cu-Cu stitch bonding for next-generation, low-cost IC packaging solutions. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Microelectronic & Electronic Packaging is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 192652048 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Enhancing Cu-Cu Stitch Bonding Reliability on Cu Leadframe Through Ultrathin Cu-Selective Passivation. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Nair%2C+Shyam+Muralidharan%22">Nair, Shyam Muralidharan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Perera%2C+Duwage+Anushka+Sandaruwan%22">Perera, Duwage Anushka Sandaruwan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Farmer%2C+Gavin%22">Farmer, Gavin</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Abraham%2C+James%22">Abraham, James</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Tran%2C+Khanh+Tuyet+Anh%22">Tran, Khanh Tuyet Anh</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Philipose%2C+Usha%22">Philipose, Usha</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Chyan%2C+Oliver%22">Chyan, Oliver</searchLink><relatesTo>1</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Microelectronic+%26+Electronic+Packaging%22">Journal of Microelectronic & Electronic Packaging</searchLink>. 2026, Vol. 23 Issue 1, p9-17. 9p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Wire+bonding+%28Electronic+packaging%29%22">Wire bonding (Electronic packaging)</searchLink><br /><searchLink fieldCode="DE" term="%22Microelectronic+packaging%22">Microelectronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Packaging+industry%22">Packaging industry</searchLink><br /><searchLink fieldCode="DE" term="%22Corrosion+prevention%22">Corrosion prevention</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Despite advances in 2.5D and 3D packaging, ultrasonic wedge (stitch) bonding remains the industry standard due to its cost-effectiveness. However, the transition to copper (Cu) and palladium-coated copper (PCC) wire introduces reliability challenges, traditionally mitigated by expensive and environmentally concerning silver (Ag) plating on leadframes (LF). To address this, we developed a low-cost, ultrathin Cu-selective passivation coating that suppresses oxidation, enabling direct Cu-Cu bonding without Ag. This process-compatible coating was evaluated on Cu-LFs using 25 µm Al-1 wt% Si and PCC wires under varying thermal conditions (125 ℃-200 ℃). Optimization of bonding force, time, and ultrasonic power yielded substantial improvements in pull strength. Notably, while bare-Cu bonds failed at the oxidized interface, passivated samples failed at the wire neck, confirming superior bond integrity. This work highlights a promising, environmentally sustainable alternative to Ag plating, enabling reliable Cu-Cu stitch bonding for next-generation, low-cost IC packaging solutions. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Microelectronic & Electronic Packaging is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.4071/001c.156190 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 9 StartPage: 9 Subjects: – SubjectFull: Wire bonding (Electronic packaging) Type: general – SubjectFull: Microelectronic packaging Type: general – SubjectFull: Packaging industry Type: general – SubjectFull: Corrosion prevention Type: general Titles: – TitleFull: Enhancing Cu-Cu Stitch Bonding Reliability on Cu Leadframe Through Ultrathin Cu-Selective Passivation. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Nair, Shyam Muralidharan – PersonEntity: Name: NameFull: Perera, Duwage Anushka Sandaruwan – PersonEntity: Name: NameFull: Farmer, Gavin – PersonEntity: Name: NameFull: Abraham, James – PersonEntity: Name: NameFull: Tran, Khanh Tuyet Anh – PersonEntity: Name: NameFull: Philipose, Usha – PersonEntity: Name: NameFull: Chyan, Oliver IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 01 Text: 2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 15514897 Numbering: – Type: volume Value: 23 – Type: issue Value: 1 Titles: – TitleFull: Journal of Microelectronic & Electronic Packaging Type: main |
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