APA (7th ed.) Citation

Kim, Y., Shim, E., Park, J. Y., Weimer, M. S., Harris, S., Raciti, D., . . . Josell, D. (2026). Improved Uniformity in Glass TSV Filling by Asymmetric Dwell Pulsed Potential Deposition. Journal of The Electrochemical Society, 173(7), 1. https://doi.org/10.1149/1945-7111/ae53bb

Chicago Style (17th ed.) Citation

Kim, Youjung, et al. "Improved Uniformity in Glass TSV Filling by Asymmetric Dwell Pulsed Potential Deposition." Journal of The Electrochemical Society 173, no. 7 (2026): 1. https://doi.org/10.1149/1945-7111/ae53bb.

MLA (9th ed.) Citation

Kim, Youjung, et al. "Improved Uniformity in Glass TSV Filling by Asymmetric Dwell Pulsed Potential Deposition." Journal of The Electrochemical Society, vol. 173, no. 7, 2026, p. 1, https://doi.org/10.1149/1945-7111/ae53bb.