APA (7th ed.) Citation

Chaudhuri, D., Rahaman, H., & Ghosh, T. (2026). A novel approach for performance improvements of TSV and TTSV of 3D IC through thermoelectric effect and mechanical reliability analysis. Sādhanā: Academy Proceedings in Engineering Sciences, 51(2), 1. https://doi.org/10.1007/s12046-026-03073-0

Chicago Style (17th ed.) Citation

Chaudhuri, Debika, Hafizur Rahaman, and Tamal Ghosh. "A Novel Approach for Performance Improvements Of TSV and TTSV Of 3D IC through thermoelectric Effect and Mechanical Reliability Analysis." Sādhanā: Academy Proceedings in Engineering Sciences 51, no. 2 (2026): 1. https://doi.org/10.1007/s12046-026-03073-0.

MLA (9th ed.) Citation

Chaudhuri, Debika, et al. "A Novel Approach for Performance Improvements Of TSV and TTSV Of 3D IC through thermoelectric Effect and Mechanical Reliability Analysis." Sādhanā: Academy Proceedings in Engineering Sciences, vol. 51, no. 2, 2026, p. 1, https://doi.org/10.1007/s12046-026-03073-0.