Silicon photonics packaging for AI datacenters: technical challenges, reliability requirements and future directions – a critical review.
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| Title: | Silicon photonics packaging for AI datacenters: technical challenges, reliability requirements and future directions – a critical review. |
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| Authors: | Gan, Chong Leong1 (AUTHOR) clgan_pgg@yahoo.com, Chung, Min-Hua1 (AUTHOR) minchung@micron.com, Huang, Chen-Yu1 (AUTHOR) lukahuang@micron.com |
| Source: | Microelectronics International. 2026, Vol. 43 Issue 3, p199-210. 12p. |
| Subjects: | Microelectronic packaging, Reliability in engineering, Temperature control, Optical interconnects, Server farms (Computer network management), Engineering design |
| Abstract: | Purpose: The purpose of this paper is to provide a systematic review of technical findings and discuss the technical challenges of Silicon photonic packaging deployment for future artificial intelligence (AI) datacenter applications. Also, with the aim of studying and comparing the hard requirements, reliability mitigation and future directions with respect to other silicon packaging options. This paper discusses the holistic overview of silicon photonics packaging reliability, technical barriers and future directions. Design/methodology/approach: Literature reviews are conducted based on a list of silicon photonics packaging solutions and possible technical solutions. Detailed AI–datacenter technical challenges, findings and selection of electronic packaging materials with optical interconnect technical requirements and hardware reliability considerations are presented in this review paper. The future and status of photonic interconnects are also discussed in this review paper. Findings: This paper briefly reviews key aspects of material selection, thermal management and alternative bonding options, focusing on reliability performance and discusses how to meet end hardware reliability requirements of Silicon photonic packaging for future AI datacenter applications. Research limitations/implications: In-depth technical review encompasses the holistic overview of silicon photonic packaging and deployment in future AI datacenters. Practical implications: The paper reveals the technical considerations when choosing the silicon photonics packaging options from components to system-level technical requirements. Originality/value: An in-depth technical review of material selection, thermal management and hardware reliability requirements in microelectronics packaging, based on prior literature. [ABSTRACT FROM AUTHOR] |
| Copyright of Microelectronics International is the property of Emerald Publishing Limited and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 193251725 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Silicon photonics packaging for AI datacenters: technical challenges, reliability requirements and future directions – a critical review. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Gan%2C+Chong+Leong%22">Gan, Chong Leong</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> clgan_pgg@yahoo.com</i><br /><searchLink fieldCode="AR" term="%22Chung%2C+Min-Hua%22">Chung, Min-Hua</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> minchung@micron.com</i><br /><searchLink fieldCode="AR" term="%22Huang%2C+Chen-Yu%22">Huang, Chen-Yu</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> lukahuang@micron.com</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Microelectronics+International%22">Microelectronics International</searchLink>. 2026, Vol. 43 Issue 3, p199-210. 12p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Microelectronic+packaging%22">Microelectronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Reliability+in+engineering%22">Reliability in engineering</searchLink><br /><searchLink fieldCode="DE" term="%22Temperature+control%22">Temperature control</searchLink><br /><searchLink fieldCode="DE" term="%22Optical+interconnects%22">Optical interconnects</searchLink><br /><searchLink fieldCode="DE" term="%22Server+farms+%28Computer+network+management%29%22">Server farms (Computer network management)</searchLink><br /><searchLink fieldCode="DE" term="%22Engineering+design%22">Engineering design</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Purpose: The purpose of this paper is to provide a systematic review of technical findings and discuss the technical challenges of Silicon photonic packaging deployment for future artificial intelligence (AI) datacenter applications. Also, with the aim of studying and comparing the hard requirements, reliability mitigation and future directions with respect to other silicon packaging options. This paper discusses the holistic overview of silicon photonics packaging reliability, technical barriers and future directions. Design/methodology/approach: Literature reviews are conducted based on a list of silicon photonics packaging solutions and possible technical solutions. Detailed AI–datacenter technical challenges, findings and selection of electronic packaging materials with optical interconnect technical requirements and hardware reliability considerations are presented in this review paper. The future and status of photonic interconnects are also discussed in this review paper. Findings: This paper briefly reviews key aspects of material selection, thermal management and alternative bonding options, focusing on reliability performance and discusses how to meet end hardware reliability requirements of Silicon photonic packaging for future AI datacenter applications. Research limitations/implications: In-depth technical review encompasses the holistic overview of silicon photonic packaging and deployment in future AI datacenters. Practical implications: The paper reveals the technical considerations when choosing the silicon photonics packaging options from components to system-level technical requirements. Originality/value: An in-depth technical review of material selection, thermal management and hardware reliability requirements in microelectronics packaging, based on prior literature. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Microelectronics International is the property of Emerald Publishing Limited and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 12 StartPage: 199 Subjects: – SubjectFull: Microelectronic packaging Type: general – SubjectFull: Reliability in engineering Type: general – SubjectFull: Temperature control Type: general – SubjectFull: Optical interconnects Type: general – SubjectFull: Server farms (Computer network management) Type: general – SubjectFull: Engineering design Type: general Titles: – TitleFull: Silicon photonics packaging for AI datacenters: technical challenges, reliability requirements and future directions – a critical review. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Gan, Chong Leong – PersonEntity: Name: NameFull: Chung, Min-Hua – PersonEntity: Name: NameFull: Huang, Chen-Yu IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 07 Text: 2026 Type: published Y: 2026 Identifiers: – Type: issn-print Value: 13565362 Numbering: – Type: volume Value: 43 – Type: issue Value: 3 Titles: – TitleFull: Microelectronics International Type: main |
| ResultId | 1 |
