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Lattice damage evolution of silicon carbide abrasives under dry friction: a molecular dynamics study.

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Title: Lattice damage evolution of silicon carbide abrasives under dry friction: a molecular dynamics study.
Authors: Feng, Xiaowei1 (AUTHOR), Zhu, Liangyu1 (AUTHOR), Hu, Yang1 (AUTHOR), Hu, Weiwen1 (AUTHOR), Jiang, Hong1 (AUTHOR), Wu, Nanxing1,2,3 (AUTHOR) jelfptocm_wnx@163.com
Source: Journal of Materials Science. Jun2026, Vol. 61 Issue 22, p15467-15483. 17p.
Subjects: Silicon carbide, Dry friction, Grinding machines, Molecular dynamics, Mechanical wear, Abrasive machining, Surface defects
Abstract: To investigate the wear process of silicon carbide (SiC) abrasive grains during the precision grinding of quartz wafers under dry friction conditions, this study simplifies the damage modes of SiC abrasive grains and develops an experimental model for surface grinding damage induced by quartz wafers on SiC grains. By integrating friction force curves with changes in surface morphology, the surface damage characteristics of SiC grains are examined. The evolution of subsurface damage (SSD) within the workpiece is investigated by analyzing the lattice phase transformation and dislocation evolution inside SiC. Synthesizing the evolution patterns of both subsurface and surface damage, the damage evolution mechanism of SiC abrasive grains is elucidated. Analysis indicates that at a grinding speed of 100 m/s, the process is dominated by surface wear, representing the most favorable condition for grinding. At this speed, the internal damage of SiC initially expands in a "flower-like" pattern under the applied load. As grinding proceeds, the petal-like expansions coalesce, and the damage propagates inward along the grinding trajectory. The leading-edge damage exhibits a conical failure mode, while the region behind the cone displays a horizontal damage pattern. This study provides a reference for further improving the grinding quality of quartz wafers and for the optimal design of SiC grinding plates. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Materials Science is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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DbLabel: Engineering Source
An: 193394410
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PubTypeId: academicJournal
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  Label: Title
  Group: Ti
  Data: Lattice damage evolution of silicon carbide abrasives under dry friction: a molecular dynamics study.
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  Data: <searchLink fieldCode="AR" term="%22Feng%2C+Xiaowei%22">Feng, Xiaowei</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhu%2C+Liangyu%22">Zhu, Liangyu</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Hu%2C+Yang%22">Hu, Yang</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Hu%2C+Weiwen%22">Hu, Weiwen</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Jiang%2C+Hong%22">Jiang, Hong</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Wu%2C+Nanxing%22">Wu, Nanxing</searchLink><relatesTo>1,2,3</relatesTo> (AUTHOR)<i> jelfptocm_wnx@163.com</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%22">Journal of Materials Science</searchLink>. Jun2026, Vol. 61 Issue 22, p15467-15483. 17p.
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  Data: <searchLink fieldCode="DE" term="%22Silicon+carbide%22">Silicon carbide</searchLink><br /><searchLink fieldCode="DE" term="%22Dry+friction%22">Dry friction</searchLink><br /><searchLink fieldCode="DE" term="%22Grinding+machines%22">Grinding machines</searchLink><br /><searchLink fieldCode="DE" term="%22Molecular+dynamics%22">Molecular dynamics</searchLink><br /><searchLink fieldCode="DE" term="%22Mechanical+wear%22">Mechanical wear</searchLink><br /><searchLink fieldCode="DE" term="%22Abrasive+machining%22">Abrasive machining</searchLink><br /><searchLink fieldCode="DE" term="%22Surface+defects%22">Surface defects</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: To investigate the wear process of silicon carbide (SiC) abrasive grains during the precision grinding of quartz wafers under dry friction conditions, this study simplifies the damage modes of SiC abrasive grains and develops an experimental model for surface grinding damage induced by quartz wafers on SiC grains. By integrating friction force curves with changes in surface morphology, the surface damage characteristics of SiC grains are examined. The evolution of subsurface damage (SSD) within the workpiece is investigated by analyzing the lattice phase transformation and dislocation evolution inside SiC. Synthesizing the evolution patterns of both subsurface and surface damage, the damage evolution mechanism of SiC abrasive grains is elucidated. Analysis indicates that at a grinding speed of 100 m/s, the process is dominated by surface wear, representing the most favorable condition for grinding. At this speed, the internal damage of SiC initially expands in a "flower-like" pattern under the applied load. As grinding proceeds, the petal-like expansions coalesce, and the damage propagates inward along the grinding trajectory. The leading-edge damage exhibits a conical failure mode, while the region behind the cone displays a horizontal damage pattern. This study provides a reference for further improving the grinding quality of quartz wafers and for the optimal design of SiC grinding plates. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Journal of Materials Science is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10853-026-12633-y
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 17
        StartPage: 15467
    Subjects:
      – SubjectFull: Silicon carbide
        Type: general
      – SubjectFull: Dry friction
        Type: general
      – SubjectFull: Grinding machines
        Type: general
      – SubjectFull: Molecular dynamics
        Type: general
      – SubjectFull: Mechanical wear
        Type: general
      – SubjectFull: Abrasive machining
        Type: general
      – SubjectFull: Surface defects
        Type: general
    Titles:
      – TitleFull: Lattice damage evolution of silicon carbide abrasives under dry friction: a molecular dynamics study.
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          Name:
            NameFull: Feng, Xiaowei
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            NameFull: Zhu, Liangyu
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            NameFull: Hu, Yang
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            NameFull: Hu, Weiwen
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            NameFull: Jiang, Hong
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            NameFull: Wu, Nanxing
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            – D: 08
              M: 06
              Text: Jun2026
              Type: published
              Y: 2026
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              Value: 61
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