APA (7th ed.) Citation

Ma, S., Sun, Y., Nan, Y., Liu, Y., & Yang, Z. (2026). Creep-shock fatigue reliability assessment of electronic component structures based on Bayesian estimation. Journal of Materials Science: Materials in Electronics, 37(13), 1. https://doi.org/10.1007/s10854-026-17409-3

Chicago Style (17th ed.) Citation

Ma, Shuai, Yi Sun, Yifei Nan, Yizhi Liu, and Zhiqiang Yang. "Creep-shock Fatigue Reliability Assessment of Electronic Component Structures Based on Bayesian Estimation." Journal of Materials Science: Materials in Electronics 37, no. 13 (2026): 1. https://doi.org/10.1007/s10854-026-17409-3.

MLA (9th ed.) Citation

Ma, Shuai, et al. "Creep-shock Fatigue Reliability Assessment of Electronic Component Structures Based on Bayesian Estimation." Journal of Materials Science: Materials in Electronics, vol. 37, no. 13, 2026, p. 1, https://doi.org/10.1007/s10854-026-17409-3.