View in EDS HTML Full Text PDF Full Text

Effects of Annealing Temperature on Interfacial Structure and Thermal Conductivity of Hot-Pressed Copper/Cr-Coated Diamond Composites.

Saved in:
Bibliographic Details
Title: Effects of Annealing Temperature on Interfacial Structure and Thermal Conductivity of Hot-Pressed Copper/Cr-Coated Diamond Composites.
Authors: Liu, Yajing1 (AUTHOR), Chen, Xiaohong2 (AUTHOR), Liu, Yong2,3 (AUTHOR), Tian, Wei1,3 (AUTHOR) tianweiusst@163.com, Zhou, Fanfan2 (AUTHOR), Zhou, Honglei2,3 (AUTHOR), Wang, Yicheng2 (AUTHOR)
Source: Materials (1996-1944). Apr2026, Vol. 19 Issue 8, p1534. 21p.
Subjects: Thermal conductivity, Interface structures, Phonon dispersion relations, Metallic composites, Magnetron sputtering, Heat transfer, Composite coating
Abstract: Efficient heat dissipation is crucial for semiconductor devices; however, conventional thermal management materials often cannot meet practical demands because of inadequate thermal conductivity and mismatched coefficients of thermal expansion with semiconductor materials. In this study, we develop a synergistic process integrating magnetron sputtering and annealing to fabricate a composition-controllable Cr/Cr3C2 composite interlayer on diamond surfaces. By regulating the annealing temperature from 700 to 1100 °C, three key parameters of the Cr/Cr3C2 composite interlayer can be tailored: the thickness varies from ~200 to 800 nm, the Cr/Cr3C2 fraction is adjustable, and the surface roughness ranges from 33.3 to 61.6 nm. In the current research, the sample that was annealed at 900 °C for 2 h exhibited the highest coating uniformity, with carbide coverage exceeding 98% and no discernible porosity. This optimized annealing process produces an interlayer with robust coverage, moderate thickness (~300 nm), and low surface roughness (Ra = 33.3 nm), thereby markedly enhancing interfacial bonding and thermal-transport performance. The resulting composite achieves a maximum thermal conductivity of 605.27 W·m−1·K−1, corresponding to 211% of the experimentally measured value for the uncoated sample. Analyses combining the diffusion mismatch model and experimentation indicate that the enhancement originates from improved phonon spectral matching and increased interfacial adhesion energy. This work provides processing guidance for precise interface engineering in high-thermal-conductivity diamond/copper composites. [ABSTRACT FROM AUTHOR]
Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
Full text is not displayed to guests.
FullText Links:
  – Type: pdflink
Text:
  Availability: 1
Header DbId: egs
DbLabel: Engineering Source
An: 193436203
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Effects of Annealing Temperature on Interfacial Structure and Thermal Conductivity of Hot-Pressed Copper/Cr-Coated Diamond Composites.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Liu%2C+Yajing%22">Liu, Yajing</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Chen%2C+Xiaohong%22">Chen, Xiaohong</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Liu%2C+Yong%22">Liu, Yong</searchLink><relatesTo>2,3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Tian%2C+Wei%22">Tian, Wei</searchLink><relatesTo>1,3</relatesTo> (AUTHOR)<i> tianweiusst@163.com</i><br /><searchLink fieldCode="AR" term="%22Zhou%2C+Fanfan%22">Zhou, Fanfan</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhou%2C+Honglei%22">Zhou, Honglei</searchLink><relatesTo>2,3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Wang%2C+Yicheng%22">Wang, Yicheng</searchLink><relatesTo>2</relatesTo> (AUTHOR)
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Materials+%281996-1944%29%22">Materials (1996-1944)</searchLink>. Apr2026, Vol. 19 Issue 8, p1534. 21p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Thermal+conductivity%22">Thermal conductivity</searchLink><br /><searchLink fieldCode="DE" term="%22Interface+structures%22">Interface structures</searchLink><br /><searchLink fieldCode="DE" term="%22Phonon+dispersion+relations%22">Phonon dispersion relations</searchLink><br /><searchLink fieldCode="DE" term="%22Metallic+composites%22">Metallic composites</searchLink><br /><searchLink fieldCode="DE" term="%22Magnetron+sputtering%22">Magnetron sputtering</searchLink><br /><searchLink fieldCode="DE" term="%22Heat+transfer%22">Heat transfer</searchLink><br /><searchLink fieldCode="DE" term="%22Composite+coating%22">Composite coating</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Efficient heat dissipation is crucial for semiconductor devices; however, conventional thermal management materials often cannot meet practical demands because of inadequate thermal conductivity and mismatched coefficients of thermal expansion with semiconductor materials. In this study, we develop a synergistic process integrating magnetron sputtering and annealing to fabricate a composition-controllable Cr/Cr3C2 composite interlayer on diamond surfaces. By regulating the annealing temperature from 700 to 1100 °C, three key parameters of the Cr/Cr3C2 composite interlayer can be tailored: the thickness varies from ~200 to 800 nm, the Cr/Cr3C2 fraction is adjustable, and the surface roughness ranges from 33.3 to 61.6 nm. In the current research, the sample that was annealed at 900 °C for 2 h exhibited the highest coating uniformity, with carbide coverage exceeding 98% and no discernible porosity. This optimized annealing process produces an interlayer with robust coverage, moderate thickness (~300 nm), and low surface roughness (Ra = 33.3 nm), thereby markedly enhancing interfacial bonding and thermal-transport performance. The resulting composite achieves a maximum thermal conductivity of 605.27 W·m−1·K−1, corresponding to 211% of the experimentally measured value for the uncoated sample. Analyses combining the diffusion mismatch model and experimentation indicate that the enhancement originates from improved phonon spectral matching and increased interfacial adhesion energy. This work provides processing guidance for precise interface engineering in high-thermal-conductivity diamond/copper composites. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=193436203
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.3390/ma19081534
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 21
        StartPage: 1534
    Subjects:
      – SubjectFull: Thermal conductivity
        Type: general
      – SubjectFull: Interface structures
        Type: general
      – SubjectFull: Phonon dispersion relations
        Type: general
      – SubjectFull: Metallic composites
        Type: general
      – SubjectFull: Magnetron sputtering
        Type: general
      – SubjectFull: Heat transfer
        Type: general
      – SubjectFull: Composite coating
        Type: general
    Titles:
      – TitleFull: Effects of Annealing Temperature on Interfacial Structure and Thermal Conductivity of Hot-Pressed Copper/Cr-Coated Diamond Composites.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Liu, Yajing
      – PersonEntity:
          Name:
            NameFull: Chen, Xiaohong
      – PersonEntity:
          Name:
            NameFull: Liu, Yong
      – PersonEntity:
          Name:
            NameFull: Tian, Wei
      – PersonEntity:
          Name:
            NameFull: Zhou, Fanfan
      – PersonEntity:
          Name:
            NameFull: Zhou, Honglei
      – PersonEntity:
          Name:
            NameFull: Wang, Yicheng
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 15
              M: 04
              Text: Apr2026
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 19961944
          Numbering:
            – Type: volume
              Value: 19
            – Type: issue
              Value: 8
          Titles:
            – TitleFull: Materials (1996-1944)
              Type: main
ResultId 1