Dynamic Amorphization and Potential Recovery Mechanisms in Silicon Carbide Fatigue: Atomic‐Scale Insights Across Single‐Crystal to Polycrystalline Structures.

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Title: Dynamic Amorphization and Potential Recovery Mechanisms in Silicon Carbide Fatigue: Atomic‐Scale Insights Across Single‐Crystal to Polycrystalline Structures.
Authors: Zeng, Qingfeng1 (AUTHOR) bht0045@tmslab.cn, Gong, Zhenyuan1 (AUTHOR), Guan, Kang2 (AUTHOR) kangguan123@gmail.com, Li, Qiuyan2 (AUTHOR), Liu, Jiantao3 (AUTHOR)
Source: Fatigue & Fracture of Engineering Materials & Structures. Jun2026, Vol. 49 Issue 6, p2217-2229. 13p.
Subjects: Amorphization, Crack propagation, Mechanical behavior of materials, Material fatigue, Strain rate, Polycrystals, Molecular dynamics, Temperature effect
Abstract: Understanding the fatigue behavior of silicon carbide (SiC) is critical for its deployment in high‐temperature environments. This work utilizes large‐scale molecular dynamics simulations to investigate fatigue‐crack propagation in both single‐crystal and polycrystalline 3C‐SiC, considering varied strain ratios (R = 0.4–0.6), strain rates (10 9–1011 s−1), and temperatures (300–1500 K). A lower strain ratio (R = 0.4) enhances fatigue life by approximately 50%, owing to crack tip amorphization that mitigates local stress concentration. Under high strain rates (1011 s−1), dynamic amorphization is promoted, which reduces crack‐propagation rates by up to 40.5% and increases the fracture toughness (KIC) by 16.3% in single‐crystal samples. Temperature exhibits the most pronounced effect: At 1500 K, polycrystalline SiC suffers a 71.6% reduction in KIC, with failure transitioning to a cooperative multigrain boundary network mechanism. Notably, cyclic loading at 1500 K leads to significantly lower amorphous content (7.4%) compared with monotonic loading (27.8%), hinting at a potential recovery‐like process during unloading phases. These atomic‐scale insights highlight microstructural and grain boundary engineering as promising strategies for improving the fatigue resistance of SiC. Summary: Crack tip amorphization at low strain ratios improves fatigue resistance.High strain rates induce dynamic amorphization, acting as shock absorbers.Grain boundary network failure dominates polycrystalline SiC at high temperatures.A novel atomic‐scale recovery (healing) mechanism is identified in SiC fatigue. [ABSTRACT FROM AUTHOR]
Copyright of Fatigue & Fracture of Engineering Materials & Structures is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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  Label: Title
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  Data: Dynamic Amorphization and Potential Recovery Mechanisms in Silicon Carbide Fatigue: Atomic‐Scale Insights Across Single‐Crystal to Polycrystalline Structures.
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  Data: <searchLink fieldCode="AR" term="%22Zeng%2C+Qingfeng%22">Zeng, Qingfeng</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> bht0045@tmslab.cn</i><br /><searchLink fieldCode="AR" term="%22Gong%2C+Zhenyuan%22">Gong, Zhenyuan</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Guan%2C+Kang%22">Guan, Kang</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> kangguan123@gmail.com</i><br /><searchLink fieldCode="AR" term="%22Li%2C+Qiuyan%22">Li, Qiuyan</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Liu%2C+Jiantao%22">Liu, Jiantao</searchLink><relatesTo>3</relatesTo> (AUTHOR)
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  Data: <searchLink fieldCode="JN" term="%22Fatigue+%26+Fracture+of+Engineering+Materials+%26+Structures%22">Fatigue & Fracture of Engineering Materials & Structures</searchLink>. Jun2026, Vol. 49 Issue 6, p2217-2229. 13p.
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  Data: <searchLink fieldCode="DE" term="%22Amorphization%22">Amorphization</searchLink><br /><searchLink fieldCode="DE" term="%22Crack+propagation%22">Crack propagation</searchLink><br /><searchLink fieldCode="DE" term="%22Mechanical+behavior+of+materials%22">Mechanical behavior of materials</searchLink><br /><searchLink fieldCode="DE" term="%22Material+fatigue%22">Material fatigue</searchLink><br /><searchLink fieldCode="DE" term="%22Strain+rate%22">Strain rate</searchLink><br /><searchLink fieldCode="DE" term="%22Polycrystals%22">Polycrystals</searchLink><br /><searchLink fieldCode="DE" term="%22Molecular+dynamics%22">Molecular dynamics</searchLink><br /><searchLink fieldCode="DE" term="%22Temperature+effect%22">Temperature effect</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Understanding the fatigue behavior of silicon carbide (SiC) is critical for its deployment in high‐temperature environments. This work utilizes large‐scale molecular dynamics simulations to investigate fatigue‐crack propagation in both single‐crystal and polycrystalline 3C‐SiC, considering varied strain ratios (R = 0.4–0.6), strain rates (10 9–1011 s−1), and temperatures (300–1500 K). A lower strain ratio (R = 0.4) enhances fatigue life by approximately 50%, owing to crack tip amorphization that mitigates local stress concentration. Under high strain rates (1011 s−1), dynamic amorphization is promoted, which reduces crack‐propagation rates by up to 40.5% and increases the fracture toughness (KIC) by 16.3% in single‐crystal samples. Temperature exhibits the most pronounced effect: At 1500 K, polycrystalline SiC suffers a 71.6% reduction in KIC, with failure transitioning to a cooperative multigrain boundary network mechanism. Notably, cyclic loading at 1500 K leads to significantly lower amorphous content (7.4%) compared with monotonic loading (27.8%), hinting at a potential recovery‐like process during unloading phases. These atomic‐scale insights highlight microstructural and grain boundary engineering as promising strategies for improving the fatigue resistance of SiC. Summary: Crack tip amorphization at low strain ratios improves fatigue resistance.High strain rates induce dynamic amorphization, acting as shock absorbers.Grain boundary network failure dominates polycrystalline SiC at high temperatures.A novel atomic‐scale recovery (healing) mechanism is identified in SiC fatigue. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Fatigue & Fracture of Engineering Materials & Structures is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1111/ffe.70256
    Languages:
      – Code: eng
        Text: English
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      Pagination:
        PageCount: 13
        StartPage: 2217
    Subjects:
      – SubjectFull: Amorphization
        Type: general
      – SubjectFull: Crack propagation
        Type: general
      – SubjectFull: Mechanical behavior of materials
        Type: general
      – SubjectFull: Material fatigue
        Type: general
      – SubjectFull: Strain rate
        Type: general
      – SubjectFull: Polycrystals
        Type: general
      – SubjectFull: Molecular dynamics
        Type: general
      – SubjectFull: Temperature effect
        Type: general
    Titles:
      – TitleFull: Dynamic Amorphization and Potential Recovery Mechanisms in Silicon Carbide Fatigue: Atomic‐Scale Insights Across Single‐Crystal to Polycrystalline Structures.
        Type: main
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          Name:
            NameFull: Zeng, Qingfeng
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            NameFull: Gong, Zhenyuan
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            NameFull: Guan, Kang
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            NameFull: Li, Qiuyan
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            NameFull: Liu, Jiantao
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          Dates:
            – D: 01
              M: 06
              Text: Jun2026
              Type: published
              Y: 2026
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              Value: 49
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              Value: 6
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            – TitleFull: Fatigue & Fracture of Engineering Materials & Structures
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