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Investigation of Bi Content Effects on Sn-0.7Cu Microstructure and Properties Under Different Processing Conditions.

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Title: Investigation of Bi Content Effects on Sn-0.7Cu Microstructure and Properties Under Different Processing Conditions.
Authors: Yu, Zhuhuan1 (AUTHOR) yzh0709qyy@xust.edu.cn, Wang, Ziyan1 (AUTHOR), Yang, Xiong1 (AUTHOR), Lv, Haiyan1 (AUTHOR), Qiang, Junfeng1 (AUTHOR), Yang, Zi1 (AUTHOR), Shangguan, Xirui1 (AUTHOR), Ma, Tianxiao1 (AUTHOR)
Source: JOM: The Journal of The Minerals, Metals & Materials Society (TMS). Jun2026, Vol. 78 Issue 6, p5622-5630. 9p.
Subjects: Lead-free solder, Directional solidification, Electronic packaging, Mechanical behavior of materials, Melting, Microstructure
Abstract: To address the demand for lead-free solders in electronic packaging and overcome Sn-Cu alloys' high melting point and insufficient mechanical properties, this study prepared Sn-0.7Cu-0.1Te-xBi solders (x = 0,2,3,4 wt%) via Te-Bi composite microalloying combined with resistance melting and directional solidification, investigating their microstructure, post-welding interfacial features, mechanical properties, and conductivity. Results showed Bi refined the β-Sn phase and modified Cu6Sn5 morphology. Directional solidification suppressed Bi segregation to realize a uniform component solid solution, while resistance melting easily caused Bi precipitation at grain boundaries. For directional solidification, 3 wt% Bi was optimal—the solder had 65 MPa tensile strength and good ductility, with a continuous, defect-free scallop-like intermetallic compound layer after welding. For resistance melting, 4 wt% Bi obtained the best hardness of 33.3 HV and tensile strength of 82.03 MPa, but ductility degraded sharply with only 8.86% elongation. Regarding conductivity, directional solidification solder resistivity rose steadily with Bi content, while resistance melting solder resistivity first increased then decreased. This study clarifies the solder's optimal composition and process, supporting high-performance Sn-Cu-based lead-free solder development. [ABSTRACT FROM AUTHOR]
Copyright of JOM: The Journal of The Minerals, Metals & Materials Society (TMS) is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 193654199
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Investigation of Bi Content Effects on Sn-0.7Cu Microstructure and Properties Under Different Processing Conditions.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Yu%2C+Zhuhuan%22">Yu, Zhuhuan</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> yzh0709qyy@xust.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Wang%2C+Ziyan%22">Wang, Ziyan</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Yang%2C+Xiong%22">Yang, Xiong</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Lv%2C+Haiyan%22">Lv, Haiyan</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Qiang%2C+Junfeng%22">Qiang, Junfeng</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Yang%2C+Zi%22">Yang, Zi</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Shangguan%2C+Xirui%22">Shangguan, Xirui</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Ma%2C+Tianxiao%22">Ma, Tianxiao</searchLink><relatesTo>1</relatesTo> (AUTHOR)
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22JOM%3A+The+Journal+of+The+Minerals%2C+Metals+%26+Materials+Society+%28TMS%29%22">JOM: The Journal of The Minerals, Metals & Materials Society (TMS)</searchLink>. Jun2026, Vol. 78 Issue 6, p5622-5630. 9p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Lead-free+solder%22">Lead-free solder</searchLink><br /><searchLink fieldCode="DE" term="%22Directional+solidification%22">Directional solidification</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+packaging%22">Electronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Mechanical+behavior+of+materials%22">Mechanical behavior of materials</searchLink><br /><searchLink fieldCode="DE" term="%22Melting%22">Melting</searchLink><br /><searchLink fieldCode="DE" term="%22Microstructure%22">Microstructure</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: To address the demand for lead-free solders in electronic packaging and overcome Sn-Cu alloys' high melting point and insufficient mechanical properties, this study prepared Sn-0.7Cu-0.1Te-xBi solders (x = 0,2,3,4 wt%) via Te-Bi composite microalloying combined with resistance melting and directional solidification, investigating their microstructure, post-welding interfacial features, mechanical properties, and conductivity. Results showed Bi refined the β-Sn phase and modified Cu6Sn5 morphology. Directional solidification suppressed Bi segregation to realize a uniform component solid solution, while resistance melting easily caused Bi precipitation at grain boundaries. For directional solidification, 3 wt% Bi was optimal—the solder had 65 MPa tensile strength and good ductility, with a continuous, defect-free scallop-like intermetallic compound layer after welding. For resistance melting, 4 wt% Bi obtained the best hardness of 33.3 HV and tensile strength of 82.03 MPa, but ductility degraded sharply with only 8.86% elongation. Regarding conductivity, directional solidification solder resistivity rose steadily with Bi content, while resistance melting solder resistivity first increased then decreased. This study clarifies the solder's optimal composition and process, supporting high-performance Sn-Cu-based lead-free solder development. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of JOM: The Journal of The Minerals, Metals & Materials Society (TMS) is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s11837-026-08304-7
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 9
        StartPage: 5622
    Subjects:
      – SubjectFull: Lead-free solder
        Type: general
      – SubjectFull: Directional solidification
        Type: general
      – SubjectFull: Electronic packaging
        Type: general
      – SubjectFull: Mechanical behavior of materials
        Type: general
      – SubjectFull: Melting
        Type: general
      – SubjectFull: Microstructure
        Type: general
    Titles:
      – TitleFull: Investigation of Bi Content Effects on Sn-0.7Cu Microstructure and Properties Under Different Processing Conditions.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Yu, Zhuhuan
      – PersonEntity:
          Name:
            NameFull: Wang, Ziyan
      – PersonEntity:
          Name:
            NameFull: Yang, Xiong
      – PersonEntity:
          Name:
            NameFull: Lv, Haiyan
      – PersonEntity:
          Name:
            NameFull: Qiang, Junfeng
      – PersonEntity:
          Name:
            NameFull: Yang, Zi
      – PersonEntity:
          Name:
            NameFull: Shangguan, Xirui
      – PersonEntity:
          Name:
            NameFull: Ma, Tianxiao
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 06
              Text: Jun2026
              Type: published
              Y: 2026
          Identifiers:
            – Type: issn-print
              Value: 10474838
          Numbering:
            – Type: volume
              Value: 78
            – Type: issue
              Value: 6
          Titles:
            – TitleFull: JOM: The Journal of The Minerals, Metals & Materials Society (TMS)
              Type: main
ResultId 1